Thermal Characterization of Packaged Semiconductor Devices
Thermal Characterization of Packaged Semiconductor Devices:With the continuing industry trends towar...
Packaged技术资料
📦 资源总数：13
📚 Packaged全部资料 (13个)
安装笔记四扁平封装无铅包装
Various ON Semiconductor components are packaged in an advanced Quad Flat–pack No–Lead Package (QFN)...
板级应用笔记的DFN和QFN封装
Various ON Semiconductor components are packaged in an advanced Dual or Quad Flat−Pack Noͨ...
安装说明NIS6111无铅封装
Various ON Semiconductor components are packaged in an advanced Quad Flat−Pack No−Lead P...
SA8025锁相环频率合成器性能简介 设计实例及常见问题的解答
The SA8025 is a 3V, 1.8GHz, SSOP 20-pin packaged fractional-Nphase locked-loop (PLL) frequency s...
The paper presents the CORDIC Algorithm, which has been implemented as an virtual component (IP core
The paper presents the CORDIC Algorithm, which has been implemented as an virtual component (IP core...
LM621无刷电机换向器
General Description The LM621 is a bipolar IC designed for commutation of brushless DC motors. The...
LM621无刷电机换向器
General Description The LM621 is a bipolar IC designed for commutation of brushless DC motors. The...
HM62256B Series
The Hitachi HM62256B Series is a CMOS static RAM organized 32,768-word ´ 8-bit. It realizes higher ...
雪崩光电二极管的偏置电压和电流检测电路
Avalanche photodiodes (APDs) are widely utilized in laserbased fiberoptic systems to conv...