探索PACKage技术的精髓,这里汇聚了418个精选资源,涵盖从基础封装到高级集成方案。无论是追求高性能半导体封装、微电子组装还是智能穿戴设备的小型化设计,都能在这里找到实用指南与案例分析。深入学习PACKage技术不仅能够提升您的专业技能,还能激发创新灵感,助力解决实际工程难题。立即加入我们,开启您的封装技术进阶之旅!
OpenSS7 This the fourth public release of the OpenSS7 Master Package. See README in the release for a sub-package listing. Most of the sub-packages in...
📅 2015-10-28
👤 cc1
package huanrongdao
import javax.swing.*
import java.awt.event.WindowEvent
import java.awt.event.WindowAdapter...
📅 2013-12-17
👤 skhlm
package news
import java.sql.ResultSet
import java.util.Vector
public class News {...
📅 2014-01-01
👤 sclyutian
Far Memory Support is only available in the PK51 package.
If you have an CA51, DK51, or Evaluation Package the far memory
support is not available...
📅 2014-12-02
👤 大三三
自适应算术编码 C语言This package was adapted from the program in "Arithmetic Coding for
Data Compression", by Ian H. Witten...
📅 2013-12-06
👤 ryb