PACKAGE
共 504 篇文章
PACKAGE 相关的电子技术资料，包括技术文档、应用笔记、电路设计、代码示例等，共 504 篇文章，持续更新中。
Stm32编译函数库
The STM32F10x Standard Peripherals Library is a complete package, consisting of device drivers for all of the standard device peripherals, for STM32 Value line(Medium and Low), Connectivity line, XL-,
am335x_pru_package-master
想要快速掌握AM335x PRU编程？这个资源包提供了丰富的示例代码和文档，帮助你解决PRU开发中的常见难题。无论是初学者还是有经验的开发者，都能从中受益。通过实际案例，你可以更高效地学习和应用PRU技术，提升嵌入式项目的性能。
new package
new QFN/QFP package with increased io.
AES1711 datasheet
AES1711指纹采集仪的datasheet
AES1711 Slide Sensor Data Sheet ---
3.9mm BGA Package
TPS71718
The TPS717xx family of low-dropout (LDO), low-power linear regulators offers very high power supply rejection (PSRR) while maintaining very low 45µA ground current in an ultra-small, five-pin SC70 pac
Bluetooth Core Spec Ver 4
This is the Specification of the Bluetooth System, covering Core Package Version 4.0. Published Dec 2009. Includes volumes 1-6.
ELIS-1024 线性图像传感器
The ELIS-1024 Linear Image Sensor consists of an array of high performance, low dark current photo-diode
pixels. The sensor features sample and hold capability, selectable resolution and advanced po
Package on Package （PoP）技术
Package on Package （PoP）技术
从2005年开始，很多元器件供应商就已经在元器件内部采用层叠式的
芯片封装形式，如BGA或者CSP，把两到三种线路层叠在同一个芯片
中。
EM-LPC1780_MDK_Routine_Package源码
EM-LPC1780_MDK_Routine_Package源码
RN0027
STM8S电机控制固件库<br>
(STM8S motor control firmware library package release 1.0)
AN2639
有关MCU无铅封装的信息和焊接建议<br>
(Soldering recommendations and package information for lead-free
microcontrollers)
STM32-MICRIUM
STM32-MICRIUM套件，包含STM32CMICOS-EVAL开发板和一本详细描述在STM32系列上实现Micrium的μC/OS-III实时操作系统核心内部机制<br>
(STM32-MICRIUM package consisting of the STM32CMICOS-EVAL board and a book
detailing the
AN3268
STM32VLDISCOVERY固件程序包<br>
(STM32VLDISCOVERY firmware package)
ST Zigbee RF4CE-1.1.0
STM32W108的ZigBee RF4CE固件库包V1.1.0<br>
(STM32W108 ZigBee RF4CE firmware package V1.1.0)
Virtex-II Platform FPGAs
Module 1:
Introduction and Overview
7 pages
• Summary of Features
• General Description
• Architecture
• Device/Package Combinations and Maximum I/O
• Ordering Examples
Module 2:
Functional D
dft
chip package introduce
MT48LC16M16 pdf
DRAM spec. and schematic package.
psasp7.0用户手册
《电力系统分析综合程序》(Power System Analysis Software Package, PSASP)是一套历史长久、功能强大、使用方便的电力系统分析程序，是高度集成和开放具有我国自主知识产权的大型软件包。 本册是PSASP7.0的概述
psasp7.0用户手册
《电力系统分析综合程序》(Power System Analysis Software Package, PSASP)是一套历史长久、功能强大、使用方便的电力系统分析程序，是高度集成和开放具有我国自主知识产权的大型软件包。 本文档是PSASP7.0安装说明手册
spi inteface
the package is spi verilog code