Emerging technologies such as WiFi and WiMAX are profoundly changing the landscape of wireless broadband. As we evolve into future generation wireless networks, a primary challenge is the support of high data rate, integrated multi- media type traffic over a unified platform. Due to its inherent advantages in high-speed communication, orthogonal frequency division multiplexing (OFDM) has become the modem of choice for a number of high profile wireless systems (e.g., DVB-T, WiFi, WiMAX, Ultra-wideband).
标签： OFDM-Based Broadband Networks Wireless
上传时间： 2020-05-31
上传用户：shancjb
Wireless communications has become a field of enormous scientific and economic interest. Recent success stories include 2G and 3G cellular voice and data services (e.g., GSM and UMTS), wireless local area networks (WiFi/IEEE 802.11x), wireless broadband access (WiMAX/IEEE 802.16x), and digital broadcast systems (DVB, DAB, DRM). On the physical layer side, traditional designs typically assume that the radio channel remains constant for the duration of a data block. However, researchers and system designers are increasingly shifting their attention to channels that may vary within a block. In addition to time dispersion caused by multipath propagation, these rapidly time-varying channels feature frequency dispersion resulting from the Doppler effect. They are, thus, often referred to as being “doubly dispersive.”
标签： Time-Varying Channels
上传时间： 2020-06-01
上传用户：shancjb
This paper reviews key factors to practical ESD protection design for RF and analog/mixed-signal (AMS) ICs, including general challenges emerging, ESD-RFIC interactions, RF ESD design optimization and prediction, RF ESD design characterization, ESD-RFIC co-design technique, etc. Practical design examples are discussed. It means to provide a systematic and practical design flow for whole-chip ESD protection design optimization and prediction for RF/AMS ICs to ensure 1 st Si design success.
标签： ESD_protection_for_RF_and_AMS_ICs
上传时间： 2020-06-05
上传用户：shancjb
Over many years, RF-MEMS have been a hot topic in research at the technology and device level. In particular, various kinds of mechanical Si-MEMS resonators and piezoelectric BAW (bulk acoustic wave) resonators have been developed. The BAW technology has made its way to commercial products for passive RF filters, in particular for duplexers in RF transceiver front ends for cellular communica- tions. Beyond their use in filters, micromachined resonators can also be used in conjunction with active devices in innovative circuits and architectures.
标签： MEMS-based Circuits Systems and
上传时间： 2020-06-06
上传用户：shancjb
GaN is an already well implanted semiconductor technology, widely diffused in the LED optoelectronics industry. For about 10 years, GaN devices have also been developed for RF wireless applications where they can replace Silicon transistors in some selected systems. That incursion in the RF field has open the door to the power switching capability in the lower frequency range and thus to the power electronic applications. Compared to Silicon, GaN exhibits largely better figures for most of the key specifications: Electric field, energy gap, electron mobility and melting point. Intrinsically, GaN could offer better performance than Silicon in terms of: breakdown voltage, switching frequency and Overall systems efficiency.
标签： GaN-on-Si Displace and SiC Si
上传时间： 2020-06-07
上传用户：shancjb
SI-PNP 60 V 0,6 A 0,6 W 100 MHz
标签： 2N2905
上传时间： 2021-07-02
上传用户：xiangshuai
THIS PUBLICATION IS COPYRIGHT PROTECTEDCopyright © 2014 IEC, Geneva, SwitzerlandAll rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any formor by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing fromeither IEC or IEC's member National Committee in the country of the requester. If you have any questions about IECcopyright or have an enquiry about obtaining additional rights to this publication, please contact the address below oryour local IEC member National Committee for further information.Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduiteni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopieet les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez desquestions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisezles coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.
标签： iec标准
上传时间： 2021-10-21
上传用户：kent
该文是 中兴通讯公司 CDMA事业部整理的硬件电路设计规范，在编写我司自己的电路设计规范中，提供了很大参考和借鉴意义，该文主要包括两大部分，一部分是原理图的制图规范，一部分是电路设计的规范，其中电路设计规范从电路设计（如通用准则、电源、时钟、逻辑器件、保护器件等多个章节展开）、可靠性设计、SI/PI设计、系统性设计、可生产性设计、可测试性等多个方向展开。并最终形成checklist逐条检验准则，干货很多。
上传时间： 2021-11-05
上传用户：
引言：产品设计越来越趋向小型化，功能多样化，并对SI，EMC 设计要求更为苛刻（如产品需认证SISPR16 CALSS B），根据单板的电源、地的种类、信号密度、板级工作频率、有特殊布线要求的信号数量，适当增加地平面是PCB 的EMC 设计的杀手锏之一。单面板，双面板已不能够满足复杂PCB 的设计要求，本文以四层板举例，讲述四层板的设置和相关的一些设计技巧，文中的有些观点，建议因为水平有限，错误之处在所难免，还望大家不断批评、指正。
标签： pads
上传时间： 2021-11-28
上传用户：shjgzh
这是一份micron ddr spec仅相关SI测试工程师测试参考
标签： ddr
上传时间： 2021-12-31
上传用户：
