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  • PCB设计软件ExpressPCB 下载

    ExpressPCB 是一款免费的PCB设计软件,简单实使。可以画双层板。 Our Free PCB software is a snap to learn and use. For the first time, designing circuit BOARDs is simple for the beginner and efficient for the professional.   Our BOARD manufacturing service makes top quality two and four layer PCBs. Use our MiniBOARD service and pay only $51 for three BOARDs (plus $8 shipping).

    标签: ExpressPCB PCB 设计软件

    上传时间: 2013-11-15

    上传用户:lchjng

  • superpro 3000u 驱动及编程器软件下载

    superpro 3000u 驱动 PIC16C65B@QFP44 [SA245] PIC16C65B:          Part number QFP44:              Package in QFP44 SA245:              Adapter purchase number AM29DL320GT@FBGA48 [SA642+B026] AM29DL320GT:        Part number FBGA48:             Package in FBGA48 SA642:              Adapter purchase number (Top BOARD with socket) B026:               Adapter purchase number (Bottom BOARD, exchangable for different parts) 87C196CA@PLCC68(universal adapter) [PEP+S414T] 87C196CA:           Part number PLCC68:             Package in PLCC68 universal adapter:  this adapter is valid for all parts in this package PEP:                The PEP (Pin-driver Expansion Pack necessary to work with the adapter S414T) S414T:              Adapter purchase number (Universal for all parts in this package) S71PL127J80B@FBGA64(special adapter) [(SA642A-B079A-Y096AF001)] S71PL127J80B:            Part number FBGA64:                  Package in FBGA64 special adapter:         this adapter is valid for this

    标签: superpro 3000u 驱动 编程器软件

    上传时间: 2013-10-23

    上传用户:Avoid98

  • PCB设计软件ExpressPCB 下载

    ExpressPCB 是一款免费的PCB设计软件,简单实使。可以画双层板。 Our Free PCB software is a snap to learn and use. For the first time, designing circuit BOARDs is simple for the beginner and efficient for the professional.   Our BOARD manufacturing service makes top quality two and four layer PCBs. Use our MiniBOARD service and pay only $51 for three BOARDs (plus $8 shipping).

    标签: ExpressPCB PCB 设计软件

    上传时间: 2013-10-09

    上传用户:1047385479

  • PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs

    Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit BOARD (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.

    标签: Considerations Guidelines and Design

    上传时间: 2013-11-09

    上传用户:ls530720646

  • 使用Nios II软件构建工具

     使用Nios II软件构建工具 This chapter describes the Nios® II Software Build Tools (SBT), a set of utilities and scripts that creates and builds embedded C/C++ application projects, user library projects, and BOARD support packages (BSPs). The Nios II SBT supports a repeatable, scriptable, and archivable process for creating your software product. You can invoke the Nios II SBT through either of the following user interfaces: ■ The Eclipse™ GUI ■ The Nios II Command Shell The purpose of this chapter is to make you familiar with the internal functionality of the Nios II SBT, independent of the user interface employed.

    标签: Nios 软件

    上传时间: 2013-10-12

    上传用户:china97wan

  • 《器件封装用户向导》赛灵思产品封装资料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the BOARD and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    标签: 封装 器件 用户 赛灵思

    上传时间: 2013-11-21

    上传用户:不懂夜的黑

  • XAPP098 - Spartan FPGA低成本、高效率串行配置

    This application note shows how to achieve low-cost, efficient serial configuration for Spartan FPGA designs. The approachrecommended here takes advantage of unused resources in a design, thereby reducing the cost, part count, memory size,and BOARD space associated with the serial configuration circuitry. As a result, neither processor nor PROM needs to be fullydedicated to performing Spartan configuration.In particular, information is provided on how the idle processing time of an on-BOARD controller can be used to loadconfiguration data from an off-BOARD source. As a result, it is possible to upgrade a Spartan design in the field by sending thebitstream over a network.

    标签: Spartan XAPP FPGA 098

    上传时间: 2013-11-01

    上传用户:wojiaohs

  • WP151 - Xilinx FPGA的System ACE配置解决方案

    Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact BOARD designs.

    标签: System Xilinx FPGA 151

    上传时间: 2013-11-23

    上传用户:kangqiaoyibie

  • XAPP740利用AXI互联设计高性能视频系统

    This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizations in certain portions of the design. The design uses five AXI video direct memory access (VDMA) engines to simultaneously move 10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary video timing signals. Data read by each AXI VDMA is sent to a common on-screen display (OSD) core capable of multiplexing or overlaying multiple video streams to a single output video stream. The output of the OSD core drives the DVI video display interface on the BOARD. Performance monitor blocks are added to capture performance data. All 10 video streams moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are controlled by a MicroBlaze™ processor. The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the Xilinx® ML605 Rev D evaluation BOARD

    标签: XAPP 740 AXI 互联

    上传时间: 2013-11-23

    上传用户:shen_dafa

  • PowerPCB培训教程

    欢迎使用 PowerPCB 教程。本教程描述了 PADS-PowerPCB  的绝大部分功能和特点,以及使用的各个过程,这些功能包括: · 基本操作 · 建立元件(Component) · 建立板子边框线(BOARD outline) · 输入网表(Netlist) · 设置设计规则(Design Rule) · 元件(Part)的布局(Placement) · 手工和交互的布线 · SPECCTRA全自动布线器(Route Engine) · 覆铜(Copper Pour) · 建立分隔/混合平面层(Split/mixed Plane) · Microsoft的目标连接与嵌入(OLE)(Object Linking Embedding) · 可选择的装配选件(Assembly options) · 设计规则检查(Design Rule Check) · 反向标注(Back Annotation) · 绘图输出(Plot Output)      使用本教程后,你可以学到印制电路板设计和制造的许多基本知识。

    标签: PowerPCB 培训教程

    上传时间: 2013-10-08

    上传用户:x18010875091