现代的电子设计和芯片制造技术正在飞速发展，电子产品的复杂度、时钟和总线频率等等都呈快速上升趋势，但系统的电压却不断在减小，所有的这一切加上产品投放市场的时间要求给设计师带来了前所未有的巨大压力。要想保证产品的一次性成功就必须能预见设计中可能出现的各种问题，并及时给出合理的解决方案，对于高速的数字电路来说，最令人头大的莫过于如何确保瞬时跳变的数字信号通过较长的一段传输线，还能完整地被接收，并保证良好的电磁兼容性，这就是目前颇受关注的信号完整性（SI）问题。本章就是围绕信号完整性的问题，让大家对高速电路有个基本的认识，并介绍一些相关的基本概念。 第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1066.2 源同步时序系统.......................................................................................1086.2.1 源同步系统的基本结构...................................................................1096.2.2 源同步时序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由来...................................................................................... 1137.2 IBIS 与SPICE 的比较.............................................................................. 1137.3 IBIS 模型的构成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相关工具及链接..............................................................................120第八章 高速设计理论在实际中的运用.............................................................1228.1 叠层设计方案...........................................................................................1228.2 过孔对信号传输的影响...........................................................................1278.3 一般布局规则...........................................................................................1298.4 接地技术...................................................................................................1308.5 PCB 走线策略............................................................................................134
标签： 信号完整性
上传时间： 2013-11-01
上传用户：xitai
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2013-11-07
上传用户：aa7821634
Programmed for Atmel STK-500 development board, detalis can be found at http://www.cs.hut.fi/Studies/T-106.5300/2007/stk500.html
标签： development Programmed Studies detalis
上传时间： 2013-12-18
上传用户：waitingfy
魔兽世界模拟服务器脚本代码. Menu->AddItem(0, " 主城传送 ",100) Menu->AddItem(0, " 初级副本传送 ",101) Menu->AddItem(0, " 中级副本传送 ",102) Menu->AddItem(0, " 团队副本传送 ",103) Menu->AddItem(0, " 外域副本传送1 ",104) Menu->AddItem(0, " 外域副本传送2 ", 105) Menu->AddItem(0, " 个人银行 ", 106) Menu->AddItem(0, " 开通飞行点 ", 107) Menu->AddItem(0, " 领取工资 ", 108) Menu->AddItem(0, " 外域传送 ", 109) Menu->AddItem(0, " 野外BOSS传送 ", 110)
上传时间： 2016-01-16
上传用户：as275944189
天空音乐程序 V5.0 商业版程序安装说明： (申明：请尊重天空音乐程序作者的劳动成果，不要随意销售或送程序，需要购买正版程序请咨询QQ：497533769) 首先说明下caiji里面有个文件function.asp不是病毒，是采集程序必须的一个文件，但是卡巴等杀毒软件会报，请不要杀掉 如果在服务器上面建立站点请设置服务器杀毒软件排除function.asp文件，具体办法是卡巴图标点右键，设置->保护->信任区域->填加->指定（并选中包括子文件夹），如果是用的其他杀毒软件类似 一. 自动安装方法： 1.下载并安装mssql2000，http://www.greendown.cn/soft/1954.html，http://www.jz123.cn/soft/7/106/2005/200509132570.html 安装MSSQL软件时候注意选择本地用户，登陆选择windows系统登陆和sql用户登陆。 2.确认机器上硬盘有D盘,把程序放到网站根目录 (注意如果,你要把数据库文件,存放在其它位置请编辑(install.bat文件第4行)和(music.sql文件第2行),请将d:\sql改为,你所需要的路径! ) 3.运行install.bat 4.手动建立站点，注意站点权限设置需要写入权限 5.进入后台/admin/index.asp,帐号密码都为admin 如果需要清空数据库并且自己采集数据的话请按照手动安装方法的5步到9步做
上传时间： 2016-03-01
上传用户：Miyuki
1.7.1 图的邻接矩阵存储表示 311 范例1-102 图的邻接矩阵存储表示 ∷相关函数：CreateFAG函数 CreateDG函数 1.7.2 图的邻接表存储表示 324 范例1-103 图的邻接表存储表示 324 ∷相关函数：CreateFAG函数 1.7.3 有向图的十字链表存储表示 335 范例1-104 有向图的十字链表存储表示 335 ∷相关函数：CreateDG函数 1.7.4 无向图的邻接多重表存储表示 344 范例1-105 无向图的邻接多重表存储表示 344 ∷相关函数：CreateGraph函数 1.7.5 最小生成树 355 范例1-106 最小生成树 355 ∷相关函数：MiniSpanTree_PRIM函数 1.7.6 关节点和重连通分量 359 范例1-107 关节点和重连通分量 359 ∷相关函数：FindArticul函数 1.7.7 拓扑排序 366 范例1-108 拓扑排序 366 ∷相关函数：TopologicalSort函数 1.7.8 关键路径 374 范例1-109 关键路径 374 ∷相关函数：CriticalPath函数 1.7.9 最短路径 383 范例1-110 最短路径 383 ∷相关函数：ShortestPath_DIJ函数 1.7.10 每一对顶点之间的最短路径 387 范例1-111 每一对顶点之间的最短路径 387 ∷相关函数：ShortestPath_FLOYD函数
上传时间： 2017-04-16
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系统要求： 1.系统必须安装IIS 2.系统必须安装.NET Framework 2.0(网上免费下载 http://dl.pconline.com.cn/html_2/1/82/id=10637&pn=0.html) 3.安装MSSQL2000 （可网上下载） 一.解压 数据库在路径： 速递网上订餐系统V2.0\数据库 其余文件为系统文件。 二.部署 1.为"速递网上订餐系统V2.0"文件夹设置虚拟路径。 2.还原数据库，数据库的默认名字为"sddb"
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上传时间： 2017-05-26
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数字处理及显示技术专辑 106册 913M滤波器设计示例(利用Matlab) 9页 0.2M.pdf
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上传时间： 2014-05-05
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数字处理及显示技术专辑 106册 913M彩色原理讲座 36页 5.0M.ppt
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上传时间： 2014-05-05
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数字处理及显示技术专辑 106册 913M开放谐振腔的时域分析 98页 1.4M.pdf
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上传时间： 2014-05-05
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