操作系统复习资料，第一章课后问题答案整理，期末考试专用
上传时间： 2019-01-03
上传用户：123hhh
马克思主义原理考试前的复习笔记，涵盖书中大部分知识点
标签： 马原复习资料
上传时间： 2019-09-06
上传用户：wht990221
四六级复习资料全面预测，各两套卷子附有答案，四六级翻译各2套。
标签： 四六级
上传时间： 2020-06-03
上传用户：wangsq
模电复习资料 可以用来期末复习 有选择 判断 还有大题
标签： 模电
上传时间： 2022-02-13
上传用户：
【1】考试大纲 2019 -2020-01-27 15:06 【2】复习资料 -2020-01-27 15:06 【3】学习视频 -2020-01-27 15:06 【4】历年真题+样题 -2020-01-27 15:06 【5】模拟题库
上传时间： 2013-07-06
上传用户：eeworm
[高频电子线路].曾兴雯.文字版.pdf 5.7M2020-03-03 16:47 高频电子线路01-13.rar 519.5M2020-03-03 16:47 高频电子线路14-26.rar 492.8M2020-03-03 16:47 高频电子线路27-39.rar 509.5M2020-03-03 16:47 高频电子线路40-45.rar 209.7M2020-03-03 16:47 高频电子线路习题.rar 469.8M2020-03-03 16:47 高频电子线路总复习.rar
上传时间： 2013-06-16
上传用户：eeworm
虽然印制电路板（PCB）布线在高速电路中具有关键的作用，但它往往是电路设计过程的最后几个步骤之一。高速 PCB 布线有很多方面的问题，关于这个题目已有人撰写了大量的文献。本文主要从实践的角度来探讨高速电路的布线问题。主要目的在于帮助新用户当设计高速电路 PCB 布线时对需要考虑的多种不同问题引起注意。另一个目的是为已经有一段时间没接触PCB 布线的客户提供一种复习资料。由于版面有限，本文不可能详细地论述所有的问题，但是我们将讨论对提高电路性能、缩短设计时间、节省修改时间具有最大成效的关键部分。
上传时间： 2013-04-24
上传用户：DanXu
单片机
标签： 单片机
上传时间： 2013-10-31
上传用户：Zxcvbnm
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
