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书籍 Advances in Human Factors and System Interactions

Human Factors and Systems Interaction aims to address the main issues of concern within systems interface with a particular emphasis on the system lifecycle development and implementation of interfaces and the general implications of virtual, augmented and mixed reality with respect to human and tec ...
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技术资料 LoRaWAN Backend Interfaces 1.0 Specification 规范

LoraWAN后台架构,网络协议和设计规范
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技术资料 高通(Qualcomm)蓝牙芯片QCC5151_硬件设计详细指导书(官方内部培训手册)

高通(Qualcomm)蓝牙芯片QCC5151_硬件设计详细指导书(官方内部培训手册)共52页其内容是针对硬件设计、部分重要元器件选择(ESD,Filter)及走线注意事项的详细说明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 2.1.3 Minimize SMPS EMI emission ...
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技术资料 电流检测电路中运算放大器与ADC的设计

电学中的测量技术涉及范围非常广,电流测量在电学计量中占有非常重要的位置。如何精确地进行电流测量是精密测量的一大难题。传统的电流检测电路多采用运算放大芯片与片外电流检测电路相结合的方式,电路集成度很低,需要较多的接口和资源才能完成对电路的检测。本文把所有电路部分都集成在一块芯片上,包括检测电阻,运算放大器 ...
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技术资料 高通蓝牙芯片QCC5144_硬件设计指导书

高通(Qualcomm)蓝牙芯片QCC5144_硬件设计详细指导书(官方内部培训手册)其内容是针对硬件设计、部分重要元器件选择(ESD,Filter)及走线注意事项的详细说明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 92.1.3 Minimize SMPS EMI emissions 2.1 ...
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技术资料 蓝牙芯片QCC5144 详细规格书

高通蓝牙芯片QCC5144 详细规格手册datasheet (共99页)含各个接口说明,应用原理图等信息。 QualcommTrueWireless™ stereo earbuds  (无线双耳) Features(特点) ■ Qualifiedto Bluetooth v5.2 specification  (蓝牙协议标准5.2) ■ 120 MHz Qualcomm ® Kalimba ™ audio DSP  (120MHz 的音频DSP ...
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技术资料 高通蓝牙芯片QCC3040 详细规格手册datasheet

高通蓝牙芯片QCC3040 详细规格手册datasheet (共96页)QualcommTrueWireless™ stereo earbuds  (无线双耳)Features(特点)■ Qualifiedto Bluetooth v5.2 specification  (蓝牙协议标准5.2)■ 120 MHz Qualcomm ® Kalimba ™ audio DSP  (120MHz 的音频DSP处理器)■ 32 MHz Developer Processor fo ...
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技术资料 GL823K 原理图

The GL823K integrates a high speed 8051 microprocessor and a high efficiency hardware engine for the best data transfer performance between USB and flash card interfaces. Its pin assignment design fits to card sockets to provide easier PCB layout. Inside the chip, it integrates 5V to 3.3V regulator, ...
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技术资料 高通蓝牙芯片qcc5127详细规格书datasheet.pdf

高通蓝牙芯片qcc5127详细规格书datasheet.pdf英文版,共97页  详细说明:1   Package information(pin allocations, pios terminal functions)2   Bluetooth subsystem 3   Cystal oscillator4   System powerstates (Idel,Active,Sleep, Off)5   Host Interface subsystem6   Appl ...
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技术资料 COMSOL声学模块介绍

Mathematical modeling has become an important part of the research and devclopment work in engineering and scicnce. Retaining a competitive edge requiresa fast path between ideas and prototypes, and in this regard mathematical modeling and simulation provide a valuable shortcut for understanding bot ...
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