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单片机编程 LPC1769 LPC1768 LPC1767 LPC176
The LPC1769/68/67/66/65/64 are ARM Cortex-M3 based microcontrollers for embedded applications featuring a high level of integration and low power consumption. The ARM Cortex-M3 is a next generation core that offers system enhancements such as enhanced debug features and a higher level of support blo ...
单片机编程 HCS12微控制器MC9S12DP256使用指南 ppt
HCS12微控制器MC9S12DP256
第一步：
1) HCS12 技术概述2) Operating Modes工作模式3) Resource Mapping资源映射4) External Bus Interface外部总线接口5) Port Integration Module端口集成模块6) Background Debug Mode背景调试模块
单片机编程 winCE msdn讲座
winCE msdn讲座 XP Embedded Now and the future
Windows XP Embedded Developmentand Deployment Model OverviewWindows XP Embedded Component ModelWindows XP Embedded Studio Tools
Microsoft WindowsXP Embedded Product Highlights
Componentized version of Windows XP Professional~ 12,000 components and update ...
教程资料 Xilinx UltraScale：新一代架构满足您的新一代架构需求（EN）
中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class ...
教程资料 《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
教程资料 WP151 - Xilinx FPGA的System ACE配置解决方案
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bo ...
教程资料 WP196-平面显示器中的Xilinx器件
 
According to CIBC World Markets, Equity Research, theFlat Panel Display (FPD) industry has achieved sufficientcritical mass for its growth to explode. Thus, it can nowattract the right blend of capital investments and R&Dresources to drive technical innovation toward continuousimprovement ...
教程资料 WP312-Xilinx新一代28nm FPGA技术简介
Xilinx Next Generation 28 nm FPGA Technology Overview
Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. ...
教程资料 WP369可扩展式处理平台-各种嵌入式系统的理想解决方案
WP369可扩展式处理平台-各种嵌入式系统的理想解决方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-c ...
教程资料 FPGA设计重利用方法(Design Reuse Methodology)
 
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many a ...