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Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...

This application note describes how to implement the Bus LVDS (BLVDS) interface in the supported Altera ® device families for high-performance multipoint applications. This application note also shows the performance analysis of a multipoint application with the Cyclone III BLVDS example.

Most designers wish to utilize as much of a device as possible in order to enhance the overallproduct performance, or extend a feature set. As a design grows, inevitably it will exceed thearchitectural limitations of the device. Exactly why a design does not fit can sometimes bedifficult to determ ...

Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bo ...

This introduction covers the fundamentals of VHDL as applied to Complex ProgrammableLogic Devices (CPLDs). Specifically included are those design practices that translate soundlyto CPLDs, permitting designers to use the best features of this powerful language to extractoptimum performance for CPLD ...

This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizat ...

XAPP520将符合2.5V和3.3V I/O标准的7系列FPGA高性能I/O Bank进行连接  The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high performance (HP) banks. HR I/O banks can be operated from 1.2V to 3.3V, whereas HP I/O banks are optimized for operation between 1.2V and ...

Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. ...

WP369可扩展式处理平台-各种嵌入式系统的理想解决方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-c ...

Prakash Rashinkar has over 15 years experience in system design and verificationof embedded systems for communication satellites, launch vehicles and spacecraftground systems, high-performance computing, switching, multimedia, and wirelessapplications. Prakash graduated with an MSEE from Regional En ...