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应用于电动汽车驱动领域的永磁同步电机交流驱动系统是由永磁同步电机、电力电子技术和控制技术相结合而形成的新型交流驱动系统。因其具有良好的运行性能而成为当代电气传动领域研究的热点之一。 永磁同步电机是一个多变量、非线性、高强耦合的系统，其输出转矩与定子电流不成正比，而是复杂的函数关系，因此要得到好的控制 ...

为了克服传统的局部特征匹配算法对噪声和图像灰度非线性变换敏感的不足，提出了基于SIFT（Scale Invariant Feature Transform）描述算子的特征匹配算法。该算法首先

Abstract: Using a DAC and a microprocessor supervisor, the system safety can be improved in industrial controllers, programmablelogiccontrollers (PLC), and data-acquisition systems. The analog output is set to zero-scale (or pin-programmable midscale) when amicroprocessor failure, optocoupler fail ...

Differential Nonlinearity: Ideally, any two adjacent digitalcodes correspond to output analog voltages that are exactlyone LSB apart. Differential non-linearity is a measure of theworst case deviation from the ideal 1 LSB step. For example,a DAC with a 1.5 LSB output change for a 1 LSB digital codec ...

ANALOG INPUT BANDWIDTH is a measure of the frequencyat which the reconstructed output fundamental drops3 dB below its low frequency value for a full scale input. Thetest is performed with fIN equal to 100 kHz plus integer multiplesof fCLK. The input frequency at which the output is −3dB relati ...

  One of the strengths of Synplify is the Finite State Machine compiler. This is a powerfulfeature that not only has the ability to automatically detect state machines in the sourcecode, and implement them with either sequential, gray, or one-hot encoding. But alsoperform a reachability ana ...

数字与模拟电路设计技巧IC与LSI的功能大幅提升使得高压电路与电力电路除外，几乎所有的电路都是由半导体组件所构成，虽然半导体组件高速、高频化时会有EMI的困扰，不过为了充分发挥半导体组件应有的性能，电路板设计与封装技术仍具有决定性的影响。 模拟与数字技术的融合由于IC与LSI半导体本身的高速化，同时为了使机器达到 ...

目录： 1. Character Type Functions － 字符类型函数 2. Standard C Input/Output Functions － 标准输入输出函数 3. Standard Library Functions － 标准库和内存分配函数 4. Mathematical Functions － 数学函数 5. String Functions － 字符串函数 6. BCD Conversion Functions － BCD 转换函数 7. Memory Acc ...

   为深入了解基于UC3854A控制的PFC变换器中的动力学特性，研究系统参数变化对变换器中分岔现象的影响，在建立Boost PFC变换器双闭环数学模型的基础上，用Matlab软件对变换器中慢时标分岔及混沌等不稳定现象进行了仿真。在对PFC变换器中慢时标分岔现象仿真的基础上，分析了系统参数变化对分岔点的影响，并进行了 ...

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...