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  Advances in low power electronics now allow placementof battery-powered sensors and other devices in locationsfar from the power grid. Ideally, for true grid independence,the batteries should not need replacement, but instead berecharged using locally available renewable energy, suchas so ...

  The LTC®4151 is a high side power monitor that includesa 12-bit ADC for measuring current and voltage, as wellas the voltage on an auxiliary input. Data is read throughthe widely used I2C interface. An unusual feature in thisdevice is its 7V to 80V operating range, allowing it to cove ...

The SN65LBC170 and SN75LBC170 aremonolithic integrated circuits designed forbidirectional data communication on multipointbus-transmission lines. Potential applicationsinclude serial or parallel data transmission, cabledperipheral buses with twin axial, ribbon, ortwisted-pair cabling. These devices ...

NXP Semiconductor designed the LPC2400 microcontrollers around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded Trace. The LPC2400 microcontrollers have 512 kB of on-chip high-speedFlash memory. This Flash memory includes a special 128-bit wide me ...

MPLAB C30用户指南(英文) HIGHLIGHTSThe information covered in this chapter is as follows:• About this Guide• Recommended Reading• Troubleshooting• The Microchip Web Site• Development Systems Customer Notification Service• Customer Support Document LayoutThe documen ...

The HCS12X family is the successor to the HCS12family, with many additional features. One new feature isthe increased memory available to the CPU and themethods available to access it. This document focuses onthe improved memory map configuration.

提出了一种改进的LSM-ALSM子空间模式识别方法，将LSM的旋转策略引入ALSM，使子空间之间互不关联的情况得到改善，提高了ALSM对相似样本的区分能力。讨论中以性能函数代替经验函数来确定拒识规则的参数，实现了识别率、误识率与拒识率之间的最佳平衡；通过对有限字符集的实验结果表明，LSM-ALSM算法有效地改善了分类器的识别 ...

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...

  The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted features are listed below; refer to Table 1.1 for specific product feature selection.

With the Altera Nios II embedded processor, you as the system designercan accelerate time-critical software algorithms by adding custominstructions to the Nios II processor instruction set. Using custominstructions, you can reduce a complex sequence of standard instructionsto a single instruction im ...