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PK51是为8051系列单片机所设计的开发工具，支持所有8051系列衍生产品，，支持带扩展存储器和扩展指令集（例如Dallas390/5240/400,Philips 51MX,Analog Devices MicroConverters）的新设备,以及支持很多公司的一流的设备和IP内核,比如Analog Devices, Atmel, Cypress Semiconductor, Dallas Semiconductor, Goal, Hynix, Inf ...

The AT89C52 is a low-power, high-performance CMOS 8-bit microcomputer with 8Kbytes of Flash programmable and erasable read only memory (PEROM). The deviceis manufactured using Atmel’s high-density nonvolatile memory technology and iscompatible with the industry-standard 80C51 and 80C52 instruction ...

自动检测80C51 串行通讯中的波特率本文介绍一种在80C51 串行通讯应用中自动检测波特率的方法。按照经验，程序起动后所接收到的第1 个字符用于测量波特率。这种方法可以不用设定难于记忆的开关，还可以免去在有关应用中使用多种不同波特率的烦恼。人们可以设想：一种可靠地实现自动波特检测的方法是可能的，它无须严格限制可 ...

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...

Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells calle ...

The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s progr ...

This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizat ...

The Tri-Mode Ethernet MAC (TEMAC) UltraController-II module is a minimal footprint,embedded network processing engine based on the PowerPC™ 405 (PPC405) processor coreand the TEMAC core embedded within a Virtex™-4 FX Platform FPGA. The TEMACUltraController-II module connects to an exte ...

多远程二极管温度传感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PC ...

A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced ...