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Abstract: Using a DAC and a microprocessor supervisor, the system safety can be improved in industrial controllers, programmablelogiccontrollers (PLC), and data-acquisition systems. The analog output is set to zero-scale (or pin-programmable midscale) when amicroprocessor failure, optocoupler fail ...

Differential Nonlinearity: Ideally, any two adjacent digitalcodes correspond to output analog voltages that are exactlyone LSB apart. Differential non-linearity is a measure of theworst case deviation from the ideal 1 LSB step. For example,a DAC with a 1.5 LSB output change for a 1 LSB digital codec ...

ANALOG INPUT BANDWIDTH is a measure of the frequencyat which the reconstructed output fundamental drops3 dB below its low frequency value for a full scale input. Thetest is performed with fIN equal to 100 kHz plus integer multiplesof fCLK. The input frequency at which the output is −3dB relati ...

数字与模拟电路设计技巧IC与LSI的功能大幅提升使得高压电路与电力电路除外，几乎所有的电路都是由半导体组件所构成，虽然半导体组件高速、高频化时会有EMI的困扰，不过为了充分发挥半导体组件应有的性能，电路板设计与封装技术仍具有决定性的影响。 模拟与数字技术的融合由于IC与LSI半导体本身的高速化，同时为了使机器达到 ...

   为深入了解基于UC3854A控制的PFC变换器中的动力学特性，研究系统参数变化对变换器中分岔现象的影响，在建立Boost PFC变换器双闭环数学模型的基础上，用Matlab软件对变换器中慢时标分岔及混沌等不稳定现象进行了仿真。在对PFC变换器中慢时标分岔现象仿真的基础上，分析了系统参数变化对分岔点的影响，并进行了 ...

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...

Agilent AN 154 S-Parameter Design Application Note S参数的设计与应用 The need for new high-frequency, solid-state circuitdesign techniques has been recognized both by microwaveengineers and circuit designers. These engineersare being asked to design solid state circuitsthat will operate at higher an ...

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...

数字与模拟电路设计技巧IC与LSI的功能大幅提升使得高压电路与电力电路除外，几乎所有的电路都是由半导体组件所构成，虽然半导体组件高速、高频化时会有EMI的困扰，不过为了充分发挥半导体组件应有的性能，电路板设计与封装技术仍具有决定性的影响。 模拟与数字技术的融合由于IC与LSI半导体本身的高速化，同时为了使机器达到 ...

  Semiconductor memory, card readers, microprocessors,disc drives, piezoelectric devices and digitally based systemsfurnish transient loads that a voltage regulator mustservice. Ideally, regulator output is invariant during a loadtransient. In practice, some variation is encountered andbeco ...