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技术资料 PW2601_2.0.pdf规格书下载
The PW2601 is a charger front-end integrated circuit designed to provide protection to Li-ionbatteries from failures of charging circuitry. The device monitors the input voltage, battery voltageand the charging current to make sure all three parameters are operated in normal range. Thedevice will sw ...
技术资料 PW2312_2.0.pdf规格书下载
The PW2312 is a high frequency, synchronous, rectified, step-down, switch-mode converter withinternal power MOSFETs. It offers a very compact solution to achieve a 1.5A peak output currentover a wide input supply range, with excellent load and line regulation.The PW2312 requires a minimal number of ...
技术资料 PW2228A-1.8.pdf规格书下载
The PW2228A is a high efficiency single inductor Buck-Boost converter which can supply theload current up to 1.5A. It provides auto-transition between Buck and Boost Mode. The PW2228Aoperates at 2.4MHz switching frequency in CCM. DC/DC converter operates at Pulse-Skipping Modeat light load. The outp ...
技术资料 PW2163D.pdf规格书下载
The PW2163D is a high frequency, synchronous, rectified, step-down, switch-mode converter withinternal powerMOSFETs. It offers a very compact solution to provide a 3A continuous current over awide input supply range,with excellent load and line regulation.The PW2163D requires a minimal number of rea ...
技术资料 PW2162_2.0.pdf规格书下载
The PW2162 is a fully integrated, high– efficiency 2A synchronous rectified step-down converter.The PW2162 operates at high efficiency over a wide output current load range. This device offerstwo operation modes, PWM control and PFM Mode switching control, which allows a high efficiencyover the wid ...
技术资料 传感器资料scb10h
SCB10H series pressure elements are high performance absolute pressure sensors. The sensors are based  on Murata's proven capacitive 3D-MEMS technology. They enable exceptional possibility for OEM customers  to integrate pressure measurement function in an optimal way into their produc ...
技术资料 SiP封装中的芯片堆叠工艺与可靠性研究
目前cPU+ Memory等系统集成的多芯片系统级封装已经成为3DSiP(3 Dimension System in Package,三维系统级封装)的主流,非常具有代表性和市场前景,SiP作为将不同种类的元件,通过不同技术,混载于同一封装内的一种系统集成封装形式,不仅可搭载不同类型的芯片,还可以实现系统的功能。然而,其封装具有更高密度和更大的发 ...
技术资料 S32K1xx Series Reference Manual 用户手册--2029页
S32K1xx Series Reference Manual 用户手册--2029页 Supports S32K116, S32K118, S32K142, S32K144, S32K146, and S32K148S32K是一款符合AEC-Q100规范、基于32位ARM Cortex-M4F和Cortex-M0+内核的MCU,适用于通用汽车和高可靠性工业应用。The S32K1xx product series further extends the highly scalable portfolio o ...
技术资料 Vivado设计流程指导手册-含安装流程与仿真
Vivado设计分为Project Mode和Non-project Mode两种模式,一般简单设计中,我们常用的是Project Mode。在本手册中,我们将以一个简单的实验案例,一步一步的完成Vivado的整个设计流程一、新建工程1、打开Vivado 2013.4开发工具,可通过桌面快捷方式或开始菜单中xilinx DesignTools-Vivado 2013.4下的Vivado 2013.4打开软件 ...
技术资料 ICN6202规格书V10
ICN6201/02 is a bridge chip which receives MIPI® DSI inputs and sends LVDS outputs.
MIPI® DSI supports up to 4 lanes and each lane operates at 1Gbps maximum; the totally maximum input
bandwidth is 4Gbps; and the MIPI defined ULPS(ultra-low-power state) is also supported. ICN6201 decodes
MIPI® ...