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教程资料 XAPP452-Spartan-3高级配置架构

This application note provides a detailed description of the Spartan™-3 configurationarchitecture. It explains the composition of the bitstream file and how this bitstream isinterpreted by the configuration logic to program the part. Additionally, a methodology ispresented that will guide th ...
https://www.eeworm.com/dl/fpga/doc/32580.html
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教程资料 WP151 - Xilinx FPGA的System ACE配置解决方案

Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bo ...
https://www.eeworm.com/dl/fpga/doc/32581.html
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教程资料 WP369可扩展式处理平台-各种嵌入式系统的理想解决方案

WP369可扩展式处理平台-各种嵌入式系统的理想解决方案 :Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-c ...
https://www.eeworm.com/dl/fpga/doc/32614.html
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教程资料 xilinx Zynq-7000 EPP产品简介

The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s progr ...
https://www.eeworm.com/dl/fpga/doc/32616.html
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教程资料 XAPP520将符合2.5V和3.3V I/O标准的7系列FPGA高性能I/O Bank进行连接

XAPP520将符合2.5V和3.3V I/O标准的7系列FPGA高性能I/O Bank进行连接  The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high performance (HP) banks. HR I/O banks can be operated from 1.2V to 3.3V, whereas HP I/O banks are optimized for operation between 1.2V and ...
https://www.eeworm.com/dl/fpga/doc/32622.html
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传感与控制 多远程二极管温度传感器 (Design Considerat

多远程二极管温度传感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PC ...
https://www.eeworm.com/dl/562/34526.html
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嵌入式综合 Linux脚本教程v2.0

This book is for students and Linux System Administrators. It provides the skills to read, write, and debug Linux shell scripts using bash shell. The book begins by describing Linux and simple scripts to automate frequently executed commands and continues by describing conditional logic, user inte ...
https://www.eeworm.com/dl/566/35851.html
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嵌入式综合 NCV7356单线CANBUS收发器数据手册

The NCV7356 is a physical layer device for a single wire data linkcapable of operating with various Carrier Sense Multiple Accesswith Collision Resolution (CSMA/CR) protocols such as the BoschController Area Network (CAN) version 2.0. This serial data linknetwork is intended for use in applications ...
https://www.eeworm.com/dl/566/35888.html
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嵌入式综合 嵌入式Linux开发详解—基于EP93XX系列ARM

本书全面介绍基于 32 位ARM 架构嵌入式微处理器的软、硬件系统的高级应用开发, 以Cirrus Logic 的EP93XX(ARM920T 核)系列微处理器为基础,包含EP93XX 的体系结 构特点、片内资源、软硬件开发平台、嵌入式操作系统移植及应用程序开发等内容,着重 强调了基于EP93XX 系统微处理器的硬件系统设计,嵌入式实时操作系统eCos ...
https://www.eeworm.com/dl/566/35913.html
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嵌入式综合 realview mdk 3.2 下载

1.增加的设备支持: Atmel AT91SAM9Rxx Cirrus Logic CS7401xx-IQZ Luminary Micro LM3S576x, LM3S5752, LM3S5747, LM3S573x, LM3S5662, LM3S5652, LM3S5632, LM3S3759, LM3S3749, and LM3S3739 NXP LPC32XX and LPC2460 STMicroelectronics STR912FAZ4X, STR912FAW4X, STR911FAW4X, STR911FAM4X, STR910FAW32, and ...
https://www.eeworm.com/dl/566/35975.html
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