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可编程逻辑 Allegro FPGA System Planner中文介绍
完整性高的FPGA-PCB系统化协同设计工具
Cadence OrCAD and Allegro FPGA System Planner便可满足较复杂的设计及在设计初级产生最佳的I/O引脚规划,并可透过FSP做系统化的设计规划,同时整合logic、schematic、PCB同步规划单个或多个FPGA pin的最佳化及layout placement,借由整合式的界面以减少重复在design及P ...
可编程逻辑 采用TÜV认证的FPGA开发功能安全系统
This white paper discusses how market trends, the need for increased productivity, and new legislation have
accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is
changing the paradigms of safety designs and will greatly reduce development e ...
可编程逻辑 远程配置Nios II处理器应用笔记
     通过以太网远程配置Nios II 处理器 应用笔记
Firmware in embedded hardware systems is frequently updated over the Ethernet. For
embedded systems that comprise a discrete microprocessor and the devices it controls, the
firmware is the software image run by the microprocessor. Wh ...
可编程逻辑 怎样使用Nios II处理器来构建多处理器系统
怎样使用Nios II处理器来构建多处理器系统
Chapter 1. Creating Multiprocessor Nios II Systems
Introduction to Nios II Multiprocessor Systems . . . . . . . . . . . . . . 1–1
Benefits of Hierarchical Multiprocessor Systems  . . . . . . . . . . . . . . . 1–2
Nios II Multiprocessor System ...
可编程逻辑 使用Nios II紧耦合存储器教程
             使用Nios II紧耦合存储器教程
Chapter 1. Using Tightly Coupled Memory with the Nios II Processor
Reasons for Using Tightly Coupled Memory  . . . . . . . . . . . . . . . . . . . . . . . 1–1
Tradeoffs  . . . . . . . ...
可编程逻辑 Nios II定制指令用户指南
     Nios II定制指令用户指南:With the Altera Nios II embedded processor, you as the system designer can accelerate time-critical software algorithms by adding custom instructions to the Nios II processor instruction set. Using custom
instructions, you can reduce a complex sequen ...
可编程逻辑 Nios II 系列处理器配置选项
    Nios II 系列处理器配置选项:This chapter describes the Nios® II Processor parameter editor in Qsys and SOPC Builder. The Nios II Processor parameter editor allows you to specify the processor features for a particular Nios II hardware system. This chapter covers the features of ...
可编程逻辑 《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
可编程逻辑 WP151 - Xilinx FPGA的System ACE配置解决方案
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bo ...
可编程逻辑 XAPP806 -决定DDR反馈时钟的最佳DCM相移
This application note describes how to build a system that can be used for determining theoptimal phase shift for a Double Data Rate (DDR) memory feedback clock. In this system, theDDR memory is controlled by a controller that attaches to either the OPB or PLB and is used inan embedded microproces ...