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Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...

This application note describes how to implement the Bus LVDS (BLVDS) interface in the supported Altera ® device families for high-performance multipoint applications. This application note also shows the performance analysis of a multipoint application with the Cyclone III BLVDS example.

Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells calle ...

Designing withProgrammable Logicin an Analog WorldProgrammable logic devicesrevolutionized digital design over 25years ago, promising designers a blankchip to design literally any functionand program it in the field. PLDs canbe low-logic density devices that usenonvolatile sea-of-gates cells calle ...

This Application Note covers the basics of how to use Verilog as applied to ComplexProgrammable Logic Devices. Various combinational logic circuit examples, such asmultiplexers, decoders, encoders, comparators and adders are provided. Synchronous logiccircuit examples, such as counters and state m ...

  Consumer display applications commonly use high-speed LVDS interfaces to transfer videodata. Spread-spectrum clocking can be used to address electromagnetic compatibility (EMC)issues within these consumer devices. This application note uses Spartan®-6 FPGAs togenerate spread-spectrum ...

  The SDI standards are the predominant standards for uncompressed digital videointerfaces in the broadcast studio and video production center. The first SDI standard,SD-SDI, allowed standard-definition digital video to be transported over the coaxial cableinfrastructure initially instal ...

This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizat ...

XAPP520将符合2.5V和3.3V I/O标准的7系列FPGA高性能I/O Bank进行连接  The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high performance (HP) banks. HR I/O banks can be operated from 1.2V to 3.3V, whereas HP I/O banks are optimized for operation between 1.2V and ...

WP409利用Xilinx FPGA打造出高端比特精度和周期精度浮点DSP算法实现方案： High-Level Implementation of Bit- and Cycle-Accurate Floating-Point DSP Algorithms with Xilinx FPGAs