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【摘要】本文结合作者多年的印制板设计经验，着重印制板的电气性能，从印制板稳定性、可靠性方面，来讨论多层印制板设计的基本要求。【关键词】印制电路板；表面贴装器件；高密度互连；通孔【Key words】Printed Circuit Board；Surface Mounting Device；High Density Interface；Via一．概述印制板（PCB－Printed Circuit ...

讨论、研究高性能覆铜板对它所用的环氧树脂的性能要求，应是立足整个产业链的角度去观察、分析。特别应从HDI多层板发展对高性能CCL有哪些主要性能需求上着手研究。HDI多层板有哪些发展特点，它的发展趋势如何——这都是我们所要研究的高性能CCL发展趋势和重点的基本依据。而HDI多层板的技术发展，又是由它的应用市场——终 ...

16 relay output channels and 16 isolated digital input channels LED indicators to show activated relays Jumper selectable Form A/Form B-type relay output channel Output status read-back Keep relay output values when hot system reset High-voltage isolation on input channels(2,500 VDC) Hi ESD pr ...

The Cyclone&reg III PCI development board provides a hardware platform for developing and prototyping low-power, high-performance, logic-intensive PCI-based designs. The board provides a high-density of the memory to facilitate the design and development of FPGA designs which need huge memory storag ...

Behavioral models are used in games and computer graphics for realistic simulation of massive crowds. In this paper, we present a GPU based implementation of Reynolds [1987] algorithm for simulating flocks of birds and propose an extension to consider environment self occlusion. We performed several ...

The CommScope InstaPATCH® 360 and ReadyPATCH® solutions utilize a standards-compliant multi-fiber connector to provide high density termination capability. The connector is called an MPO (Multi-fiber Push On) connector by the standards. In many cases, multi-fiber connector products are referred to ...

贴片铝电解电容封装库 SMD Aluminum Electrolytic Capacitors VE Features ‧ 3 ~ 16φ, 85℃, 2,000 hours assured ‧ Chip type large capacitance capacitors ‧ Designed for surface mounting on high density PC board. ‧ RoHS Compliance

With billions of ‘people and things’ becoming increasingly connected, the need to combine the potential of unlicensed and licensed wireless services has become an imperative for the operators, cities, high density venues and players focused on key market opportunities such as IoT, big data and 5G. ...

The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysi ...

Achieving High Power Density Designs