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MPC7400 Part Number SpeciÞcationThis document describes part number speciÞc changes to recommended operating conditions and revised electrical speciÞcations,as applicable, from those described in the generalMPC7400 Hardware SpeciÞcations.SpeciÞcations provided in this P ...

This document describes part number speciÞc changes to recommended operating conditions and revised electrical speciÞcations,as applicable, from those described in the generalMPC7400 Hardware SpeciÞcations.SpeciÞcations provided in this Part Number SpeciÞcation supersed ...

当拿到一张CASE单时，首先得确定的是能用什么母体才能实现此功能，然后才能展开对外围硬件电路的设计，因此首先得了解每个母体的基本功能及特点，下面大至的介绍一下本公司常用的IC：单芯片解决方案• SN8P1900 系列–  高精度 16-Bit  模数转换器–  可编程运算放大器 (PGIA)•  信号 ...

//芯片资料请到www.elecfans.com查找 //DS1820 C51 子程序//这里以11.0592M晶体为例，不同的晶体速度可能需要调整延时的时间//sbit DQ =P2^1;//根据实际情况定义端口 typedef unsigned char byte;typedef unsigned int  word; //延时void delay(word useconds){  for(;useconds>0;useconds--);} //复位byte ow_re ...

单片机应用技术选编10 目录 第一章 专题论述1.1 嵌入式系统的技术发展和我们的机遇(2)1.2 一种新的电路设计和实现方法——进化硬件(8)1.3 从8/16位机到32位机的系统设计(13)1.4 混合SoC设计(18)1.5 AT24系列存储器数据串并转换接口的IP核设计(23)1.6 低能耗嵌入式系统的设计(28)1.7 嵌入式应用中的零功耗系统设计(31)1.8 数 ...

　如同今天的许多通用单片机(MCU)已经把USB、CAN和以太网作为标准外设集成在芯片内部一样，越来越多的无线网络芯片和无线网络解决方案也在向集成SoC 方向发展，比如第一代产品，Nordic公司nRF905，Chipcon公司cc1010 他们集成了8051兼容的单片机.这些无线单片机适合一般的点对点和点对多点的私有网络应用，如单一产品的遥控 ...

针对使用硬件描述语言进行设计存在的问题，提出一种基于FPGA并采用DSP Builder作为设计工具的数字信号处理器设计方法。并按照Matlab/Simulink/DSP Builder/QuartusⅡ设计流程，设计了一个12阶FIR 低通数字滤波器，通过Quartus 时序仿真及嵌入式逻辑分析仪SignalTapⅡ硬件测试对设计进行了验证。结果表明，所设计的FIR 滤波 ...

Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, before placing orders, that information being relied onis curren ...

There has long been a need for portable ultrasoundsystems that have good resolution at affordable costpoints. Portable systems enable healthcare providersto use ultrasound in remote locations such asdisaster zones, developing regions, and battlefields,where it was not previously practical to do so ...

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...