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为了能够满足基站易于选址、优质快速的建站要求和易维护、低成本、高可靠的运行要求，本文对以方舱来实现一体化结构基站做出一番探讨。从系统设计的观点阐述了移动通信高性能基站天线设计的几个关键问题，介绍了智能天线技术在基站中的应用，并且用HFSS软件仿真了一种新型的对称阵子天线，该天线驻波比小于2的带宽可以达到6 ...

   针对UHF读写器设计中，在符合EPC Gen2标准的情况下，对标签返回的高速数据进行正确解码以达到正确读取标签的要求，提出了一种新的在ARM平台下采用边沿捕获统计定时器数判断数据的方法，并对FM0编码进行解码。与传统的使用定时器定时采样高低电平的FM0解码方法相比，该解码方法可以减少定时器定时误差累积的影 ...

Agilent AN 154 S-Parameter Design Application Note S参数的设计与应用 The need for new high-frequency, solid-state circuitdesign techniques has been recognized both by microwaveengineers and circuit designers. These engineersare being asked to design solid state circuitsthat will operate at higher an ...

  Multioutput monolithic regulators are easy to use and fi tinto spaces where multichip solutions cannot. Nevertheless,the popularity of multioutput regulators is temperedby a lack of options for input voltages above 30V andsupport of high output currents. The LT3692A fi lls thisgap with a ...

The RT9018A/B is a high performance positive voltage regulator designed for use in applications requining very low Input voltage and very low dropout voltage at up to 3A(peak).

The NXP LPC314x combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, three channel10-bit A/D, and a myriad of serial and parallel interfaces in a single chip targeted atconsumer, industrial, medical, and communication mark ...

The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embeddedapplications. The ARM Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC1850/30/20/10 operate at CPU ...

The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embeddedapplications. The ARM Cortex-M4 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC4350/30/20/10 operate at CPU ...

The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, in ...

The super-junction structure, which has P-type pillar layers as shown left, realizes high withstand voltage and ON-resistance lower than the conventional theoretical limit of silicon.