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Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. ...

This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizat ...

Abstract: This reference design provides design ideas for a cost-effective, low-power liquid-level measurement dataacquisition system (DAS) using a compensated silicon pressure sensor and a high-precision delta-sigma ADC. Thisdocument discusses how to select the compensated silicon pressure sensor ...

The LPC2292/2294 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum ...

Abstract: High-speed and low-speed data converters serve critical functions in modern broadband mobile radios. This application note outlines how todetermine high-speed data converter performance requirements in baseband sampling radio architectures. Also, system partition strategies andadvantages ...

　　中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html 　　Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture 　 　The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class ...

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...

This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizat ...

Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. ...

This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on b ...