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教程资料 《器件封装用户向导》赛灵思产品封装资料

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
https://www.eeworm.com/dl/fpga/doc/32374.html
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教程资料 CPLD和FPGA设计介绍

Field Programmable Gate Arrays (FPGAs) are becoming a critical part of every system design. Many vendors offer many different architectures and processes. Which one is right for your design? How do you design one of these so that it works correctly and functions as you expect in your entire system ...
https://www.eeworm.com/dl/fpga/doc/32627.html
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教程资料 扩频通信芯片STEL-2000A的FPGA实现

针对传统集成电路(ASIC)功能固定、升级困难等缺点,利用FPGA实现了扩频通信芯片STEL-2000A的核心功能。使用ISE提供的DDS IP核实现NCO模块,在下变频模块调用了硬核乘法器并引入CIC滤波器进行低通滤波,给出了DQPSK解调的原理和实现方法,推导出一种简便的引入?仔/4固定相移的实现方法。采用模块化的设计方法使用VHDL语言 ...
https://www.eeworm.com/dl/fpga/doc/32653.html
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嵌入式综合 Linux脚本教程v2.0

This book is for students and Linux System Administrators. It provides the skills to read, write, and debug Linux shell scripts using bash shell. The book begins by describing Linux and simple scripts to automate frequently executed commands and continues by describing conditional logic, user inte ...
https://www.eeworm.com/dl/566/35851.html
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嵌入式综合 labview教程pdf免费下载

第一课 labview概述..................4 第一节  虚拟仪器(VI)的概念..4 第二节  labview的操作模板........6 工具模板(Tools Palette).........6 控制模板(Controls Palette).........7 功能模板(Functions Palette).......8 第三节  创建一个VI程序..........10 1. 前面板...10 框图程序..... ...
https://www.eeworm.com/dl/566/35955.html
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嵌入式综合 labview教程ppt

一篇长90页的PPT和10个左右的示例源程序,对于自学能力强且有一定计算机编程基础的人来说上手还是很快的。   •Understand the components of a Virtual Instrument •Introduce labview and common labview functions •Build a simple data acquisition application •Create a subroutine ...
https://www.eeworm.com/dl/566/35964.html
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无线通信 移动无线终端导航AFE和数据转换器

Abstract: High-speed and low-speed data converters serve critical functions in modern broadband mobile radios. This application note outlines how todetermine high-speed data converter performance requirements in baseband sampling radio architectures. Also, system partition strategies andadvantages ...
https://www.eeworm.com/dl/510/36067.html
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ARM LPC315x系列ARM微控制器用户手册

The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, in ...
https://www.eeworm.com/dl/553/36646.html
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可编程逻辑 使用Nios II紧耦合存储器教程

             使用Nios II紧耦合存储器教程 Chapter 1. Using Tightly Coupled Memory with the Nios II Processor Reasons for Using Tightly Coupled Memory  . . . . . . . . . . . . . . . . . . . . . . . 1–1 Tradeoffs  . . . . . . . ...
https://www.eeworm.com/dl/kbcluoji/39390.html
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可编程逻辑 《器件封装用户向导》赛灵思产品封装资料

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
https://www.eeworm.com/dl/kbcluoji/39540.html
下载: 33
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