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书籍 Electric Vehicles in Smart Grids
Plug in Electric Vehicles (PEVs) use energy storages usually in the form of
battery banks that are designed to be recharged using utility grid power. One
category of PEVs are Electric Vehicles (EVs) without an Internal-Combustion
(IC) engine where the energy stored in the battery bank is the only so ...
书籍 Advanced+Chipless+RFID
The author’s group has developed various chipless RFID tags and reader architectures
at 2.45, 4–8, 24, and 60 GHz. These results were published extensively in the form of
books, book chapters, refereed conference and journal articles, and finally, as patent
applications. However, there is still ro ...
书籍 RFID-WSN+Integrated+Architecture
Radio frequency identification (RFID) and Wireless sensor networks (WSN) are
the two key wireless technologies that have diversified applications in the present
and the upcoming systems in this area. RFID is a wireless automated recognition
technology which is primarily used to recognize objects or ...
技术资料 IEC 62368_2014--安規
THIS PUBLICATION IS COPYRIGHT PROTECTEDCopyright © 2014 IEC, Geneva, SwitzerlandAll rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any formor by any means, electronic or mechanical, including photocopying and microfilm, without permission i ...
技术资料 高效率射频微波固态功率放大器
Research on microwave power amplififiers has gained a growing importance demanded by the many continuously developing applications which require such subsystem performance. A broad set of commercial and strategic systems in fact have their overall performance boosted by the power amplififier, the la ...
技术资料 单片机实现ADPCM编码和解码
INTRODUCTION In the past, adding speech recording and playback capability to a product meant using a digital signal processor or a specialized audio chip. Now, using a simplified Adaptive Differential Pulse Code Modulation(ADPCM) algorithm, these audio capabilities can be added to any PICmicro devic ...
技术资料 VITA46-48-42 技术资料
VITA 46 Highlights Retain standard 6U and 3U form-factors Height, depth, pitch, front panel arrangements, conduction-cooled interfaces, etc.Support standard-length PMC and XMC modules· Support high-speed serial fabric on the backplane Tyco MultiGig RT2,7-row connector· Support VME and PCI int ...