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教程资料 《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
教程资料 Virtex-6 FPGA PCB设计手册
Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the developmentof designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit theDocumentation in ...
教程资料 CPLD库指南
Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you
solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce,
distribute, republish, download, display, post, or transmit the D ...
通信网络 HITECH与电脑的通信协议
1 Communication Protocol (Computer as master)
 
The communication protocol describes here allows your computer to access 4096 internal registers (W0000-W4095) and 1024 internal relays&n ...
嵌入式综合 PICMG_COM_0_R2_0COMe规范--原文资料
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced ...
无线通信 ZigBee无线传感网络的路由协议研究
 为满足无线网络技术具有低功耗、节点体积小、网络容量大、网络传输可靠等技术要求，设计了一种以MSP430单片机和CC2420射频收发器组成的无线传感节点。通过分析其节点组成，提出了ZigBee技术中的几种网络拓扑形式，并研究了ZigBee路由算法。针对不同的传输要求形式选用不同的网络拓扑形式可以尽大可能地减少系统成本。 ...
无线通信 CF卡技术资料
The information in this specification is subject to change without notice.Use of this specification for product design requires an executed license agreement from the CompactFlashAssociation.The CompactFlash Association shall not be liable for technical or editorial errors or omissions contained her ...
可编程逻辑 《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
可编程逻辑 Virtex-6 FPGA PCB设计手册
Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the developmentof designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit theDocumentation in ...
可编程逻辑 CPLD库指南
Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you
solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce,
distribute, republish, download, display, post, or transmit the D ...