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模拟电子 Analog Circuit Design in Porta

•Founded in Jan. 08, 2001 in Shanghai, China.•Fabless IDH focused on Analog & Mixed Signal Chip design & marketing •Over 100 IC introduced.•Over 200 OEM Customer worldwide•ISO-9000 Certified•Distribution Channel in Taiwan, China & Japan To achieve 100% customer sa ...
https://www.eeworm.com/dl/571/21399.html
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模拟电子 模拟cmos集成电路设计(design of analog

模拟集成电路的设计与其说是一门技术,还不如说是一门艺术。它比数字集成电路设计需要更严格的分析和更丰富的直觉。严谨坚实的理论无疑是严格分析能力的基石,而设计者的实践经验无疑是诞生丰富直觉的源泉。这也正足初学者对学习模拟集成电路设计感到困惑并难以驾驭的根本原因。.美国加州大学洛杉机分校(UCLA)Razavi教授凭 ...
https://www.eeworm.com/dl/571/21468.html
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PCB相关 PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs

Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsidera ...
https://www.eeworm.com/dl/501/21612.html
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PCB相关 开关电源EMI设计(英文版)

Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This wor ...
https://www.eeworm.com/dl/501/22307.html
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单片机编程 C8051FXXX PCB design notes

C8051FXXX PCB design notes
https://www.eeworm.com/dl/502/28198.html
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教程资料 FPGA设计重利用方法(Design Reuse Methodology)

  FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many a ...
https://www.eeworm.com/dl/fpga/doc/32621.html
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传感与控制 多远程二极管温度传感器 (Design Considerat

多远程二极管温度传感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PC ...
https://www.eeworm.com/dl/562/34526.html
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无线通信 Rf And Microwave Power Amplifier Design(2005)

The main objective of this book is to present all the relevant informationrequired for RF and micro-wave power amplifier design includingwell-known and novel theoretical approaches and practical design techniquesas well as to suggest optimum design approaches effectively combininganalytical calcul ...
https://www.eeworm.com/dl/510/36010.html
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无线通信 RF circuit design theory and application(射频电路设计)

RF circuit design theory and application(射频电路设计)
https://www.eeworm.com/dl/510/36013.html
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可编程逻辑 Allegro-Design-Editor-Tutorial_ade_tut

Trademarks: Trademarks and service marks of Cadence Design Systems, Inc. (Cadence) contained in
https://www.eeworm.com/dl/kbcluoji/38616.html
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