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技术资料 STM32F10xx4/6 errata sheet

STM32F101x4/6、STM32F102x4/6和STM32F103x4/6小容量产品局限 (STM32F101x4/6, STM32F102x4/6 and STM32F103x4/6 low-density device limitations)
https://www.eeworm.com/dl/968563.html
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技术资料 频谱分析仪DPX® 采集技术基础入门手册

泰克实时频谱分析仪(RSA)采用泰克已获专利的数字荧光技术或DPX®,可以揭示传统频谱分析仪和矢量信号分析仪会完全漏掉的信号细节。 全面运动的 DPX 实时 RF频谱画面显示您以前没有见到的信号,用户可以立即查看信息,大大加快发现和诊断问题的速度。 DPX是所有泰克实时频谱分析仪中的标配功能。通过泰克最近推出的实时DPX ...
https://www.eeworm.com/dl/858221.html
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电源技术 LTM4600 DCDC微型模块热性能

  The LTM4600 DC/DC μModule regulator is a complete highpower density stepdown regulator for 10A continuous (14Apeak) loads. The device has two voltage options: 20VINmaximum for the LTM4600EV and 28VIN maximum for theLTM4600HVEV each housed in a small 15mm ¥ 15mm ¥2.8mm LGA surfa ...
https://www.eeworm.com/dl/505/24396.html
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其他书籍 The Cyclone&reg III PCI development board provides a hardware platform for developing and prototypi

The Cyclone&reg III PCI development board provides a hardware platform for developing and prototyping low-power, high-performance, logic-intensive PCI-based designs. The board provides a high-density of the memory to facilitate the design and development of FPGA designs which need huge memory storag ...
https://www.eeworm.com/dl/542/397990.html
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书籍 ESD Protection Development

The goal of this book is to introduce the simulation methods necessary to describe the behaviour of semiconductor devices during an electrostatic discharge (ESD). The challenge of this task is the correct description of semiconductor devices under very high current density and high temperature trans ...
https://www.eeworm.com/dl/522255.html
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论文 Chemical mechanical polishing

The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysi ...
https://www.eeworm.com/dl/522274.html
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技术资料 QCLDPC码的研究与FPGA实现

低密度校验码(Low-Density Parity-Check Codes,LDPC)已经被证明是一类纠错性能逼近香农限的渐近好码。由于低密度校验码具有译码复杂度低、错误平层低等诸多优点,它的良好应用前景已经引起学术界和IT业界的高度重视,也使...
https://www.eeworm.com/dl/930256.html
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技术资料 STM32F101xFG 产品型号: STM32F101VG STM32F101RF STM32F101VF

超大容量基本型产品:基于ARM核心的32位微控制器,具有768K至1M字节闪存、15个定时器、1个ADC模块和10个通信接口 (XL-density access line, ARM-based 32-bit MCU with 768 KB to 1 MB Flash, 15 timers, 1 ADC and 10 communication interfaces)
https://www.eeworm.com/dl/968550.html
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技术资料 STM32F100xCDE 产品型号: STM32F100ZE STM32F100ZD STM32F100ZC STM32F100VE ST

大容量超值型产品:基于ARM核心的32位微控制器,具有256至512K字节闪存、16个定时器、1个ADC模块、1个DAC模块和11个通信接口 (High-density value line, advanced ARM-based 32-bit MCU with 256 to 512 KB Flash, 16 timers, ADC, DAC & 11 comm interfaces) ...
https://www.eeworm.com/dl/968556.html
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技术资料 STM32F103xC/D/E 产品型号: STM32F103ZE STM32F103ZD STM32F103ZC STM32F103VE

大容量增强型产品:基于ARM核心的32位微控制器,具有多达512K字节闪存、USB接口、CAN接口、11个定时器、3个ADC模块和13个通信接口 (High-density Performance line, ARM-based 32-bit MCU with up to 512 KB Flash, USB, CAN, 11 timers, 3 ADCs and 13 communication interfaces) ...
https://www.eeworm.com/dl/968557.html
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