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软件工程 this is the documentation for intel processors, first volume. it contains detailed specification and

this is the documentation for intel processors, first volume. it contains detailed specification and instrucion set - for hardcore programers on assembly
https://www.eeworm.com/dl/540/449164.html
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VHDL/FPGA/Verilog This tutorial presents some basic concepts that can be helpful in debugging of application programs

This tutorial presents some basic concepts that can be helpful in debugging of application programs written in the Nios II assembly language, which run on Altera’s DE2 boards.
https://www.eeworm.com/dl/663/453245.html
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matlab例程 AHP toolbox AHPCALC Perform a complete AHP calculation. AHPHIER One-step hierarchic

AHP toolbox AHPCALC Perform a complete AHP calculation. AHPHIER One-step hierarchical assembly of AHP weighting vector. AHPREORDER Internal reordering function called by AHPCALC. AHPVECTOR Calculate the AHP ranking or weighting vector from an AHP reciproal matrix. ...
https://www.eeworm.com/dl/665/463764.html
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DSP编程 This project contains a C algorithm for calculating the results of a custom polynomial function. It

This project contains a C algorithm for calculating the results of a custom polynomial function. It is designed and optimized especially for the Starcore 140 DSP ! Inside the archive you can also find the assembly code and the matlab test program which you can use to test the accuracy of the program ...
https://www.eeworm.com/dl/516/489192.html
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行业应用文档 assembly

used for script
https://www.eeworm.com/dl/509575.html
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书籍 Pico-solar Electric Systems

This book provides a comprehensive overview of the technology behind the pico-solar revolution and offers guidance on how to test and choose quality products. The book also discusses how pioneering companies and initiatives are overcoming challenges to reach scale in the market- place, from innovati ...
https://www.eeworm.com/dl/522335.html
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书籍 Power+Electronic+Modules+Design+Manufacture

A power semiconductor module is basically a power circuit of different materials assembled together using hybrid technology, such as semiconduc- tor chip attachment, wire bonding, encapsulation, etc. The materials involved cover a wide range from insulators, conductors, and semiconduc- tors to organ ...
https://www.eeworm.com/dl/522342.html
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书籍 automation-and-robotics

In this book for the optimisation of assembly conveyor lines we are dealing with series part production featured by a medium complexity degree and a medium number of individual components and assembly technique alternatives. Modern production techniques for medium to large series products or mass pr ...
https://www.eeworm.com/dl/522490.html
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技术资料 AT89S52-24单片机最小系统开发板ALTIUM设计硬件原理图+PCB文件 2层板设计 大小为1

AT89S52-24单片机最小系统开发板ALTIUM设计硬件原理图+PCB文件,2层板设计,大小为121x149mm,Altium Designer 设计的工程文件,包括完整的原理图及PCB文件,可以用Altium(AD)软件打开或修改,可作为你的产品设计的参考。主要器件型号列表如下:Library Component Count : 14Name            ...
https://www.eeworm.com/dl/745855.html
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技术资料 AT89S52单片机主8入8出继电器工控主板ALTIUM设计硬件原理图+PCB文件

AT89S52单片机主8入8出继电器工控主板ALTIUM设计硬件原理图+PCB文件,2层板设计,大小为121x149mm,Altium Designer 设计的工程文件,包括完整的原理图及PCB文件,可以用Altium(AD)软件打开或修改,可作为你的产品设计的参考。主要器件型号列表如下:Library Component Count : 25Name          &n ...
https://www.eeworm.com/dl/745856.html
下载: 6
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