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其他书籍 IEEE 802.11F-2003 IEEE Recommended Practice for Multi-Vendor Access Point Interoperability via an In
IEEE 802.11F-2003 IEEE Recommended Practice for Multi-Vendor Access Point Interoperability via an Inter-Access Point Protocol Across Distribution Systems Supporting IEEE 802.11 Operation
技术资料 TO直插元件封装 Altium封装 AD封装库 2D+3D PCB封装库-8MB
TO直插元件封装 Altium封装 AD封装库 2D+3D PCB封装库-8MB,Altium Designer设计的PCB封装库文件,集成2D和3D封装,可直接应用的到你的产品设计中。PCB库封装列表:omponent Count : 60Component Name-----------------------------------------------TO-18TO-220-LMTO-220-LM-3TO-247TO-251TO-263-5TO-264-AATO3TO5TO39TO6 ...