pcb1.rep

基于51单片机的LIN主节点的设计

Teardrop Report PCB1.PcbDoc
On 2008-8-29 at 下午 03:37:55

Pads visited                : 91

Pad teardrops failed : 17

Pad U2-3(3582.362mil,2975mil)  Bottom Layer
Pad U2-4(3582.362mil,2925mil)  Bottom Layer
Pad U2-7(3377.638mil,3025mil)  Bottom Layer
Pad U2-6(3377.638mil,2975mil)  Bottom Layer
Pad U2-5(3377.638mil,2925mil)  Bottom Layer
Pad U2-2(3582.362mil,3025mil)  Bottom Layer
Pad U1-20(2145mil,2010mil)  Multi-Layer
Pad C2-2(2665mil,2370mil)  Multi-Layer
Pad C2-1(2665mil,2420mil)  Multi-Layer
Pad J1-7(4414.528mil,2058.11mil)  Multi-Layer
Pad J1-3(4360mil,2169.922mil)  Multi-Layer
Pad J1-9(4196.418mil,2058.11mil)  Multi-Layer
Pad JP1-12(2685mil,4400mil)  Multi-Layer
Pad C1-1(2665mil,1980mil)  Multi-Layer
Pad C1-2(2665mil,2030mil)  Multi-Layer
Pad JP3-2(4760mil,2700mil)  Multi-Layer
Pad C5-2(5005mil,4085mil)  Multi-Layer