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(PCB MCUPRO
(description
(timeStamp "2009 07 20 02 00 09")
(program "CAPTURE.EXE" (Version "10.5.0.b001 CIS"))
(source "Original data from OrCAD/CAPTURE schematic")
(title "")
(date "Monday, July 20, 2009")
(document "E:\\MCU最小系统\\ORCAD\\MCUPRO.DSN")
(revision "")
(organization "")
(address1 "")
(address2 "")
(address3 "")
(address4 "")
(partvaluecombine "{Value}")
(pcbfootprintcombine "{PCB Footprint}"))
(structure )
(placement
(component CON1
(place J6
(property
("PCB Footprint" CON1P)
(timestamp 001C4ADA)
("Source Package" CON1)
(Value ALE))))
(component CON2
(place OUTPOWER
(property
("PCB Footprint" CON2P)
(timestamp 00242561)
("Source Package" CON2)
(Value VCC)))
(place USB
(property
("PCB Footprint" "CON-USB")
(timestamp 0020CD47)
("Source Package" CON2)
(Value VCC)))
(place J10
(property
("PCB Footprint" CON2P)
(timestamp 0020C30F)
("Source Package" CON2)
(Value POWER)))
(place J12
(property
("PCB Footprint" CON2P)
(timestamp 0020C3C3)
("Source Package" CON2)
(Value VCC)))
(place J13
(property
("PCB Footprint" CON2P)
(timestamp 0023152C)
("Source Package" CON2)
(Value POWER)))
(place J17
(property
("PCB Footprint" CON2P)
(timestamp 001DC6B5)
("Source Package" CON2)
(Value CON2)))
(place J19
(property
("PCB Footprint" CON2P)
(timestamp 0020C3F3)
("Source Package" CON2)
(Value GND)))
(place J20
(property
("PCB Footprint" CON2P)
(timestamp 00213C8B)
("Source Package" CON2)
(Value CON2)))
(place J21
(property
("PCB Footprint" CON2P)
(timestamp 0026719D)
("Source Package" CON2)
(Value CON2)))
(place J5
(property
("PCB Footprint" CON2P)
(timestamp 001FA6B0)
("Source Package" CON2)
(Value CON2)))
(place J23
(property
("PCB Footprint" CON2P)
(timestamp 00213E4A)
("Source Package" CON2)
(Value CON2)))
(place J7
(property
("PCB Footprint" CON2P)
(timestamp 001CBC0B)
("Source Package" CON2)
(Value POWER)))
(place J8
(property
("PCB Footprint" CON2P)
(timestamp 001F91EB)
("Source Package" CON2)
(Value TXD/RXD)))
(place J24
(property
("PCB Footprint" CON2P)
(timestamp 001E2402)
("Source Package" CON2)
(Value CON2)))
(place J9
(property
("PCB Footprint" CON2P)
(timestamp 001D5020)
("Source Package" CON2)
(Value CON2))))
(component MAX232_0
(place U10
(property
("PCB Footprint" "DIP-16")
(timestamp 0023155C)
("Source Package" MAX232_0)
(Value MAX232))))
(component R_1
(place R19
(property
("PCB Footprint" RES1)
(timestamp 002314BA)
("Source Package" R_1)
(Value 510))))
(component CON3
(place J11
(property
("PCB Footprint" CON3P)
(timestamp 0020C36F)
("Source Package" CON3)
(Value VCC)))
(place J15
(property
("PCB Footprint" CON3P)
(timestamp 002270F9)
("Source Package" CON3)
(Value CON3)))
(place J18
(property
("PCB Footprint" CON3P)
(timestamp 0020C385)
("Source Package" CON3)
(Value GND)))
(place J25
(property
("PCB Footprint" CON3P)
(timestamp 002671B9)
("Source Package" CON3)
(Value CON3))))
(component AT89C52_6
(place U1
(property
("PCB Footprint" "DIP-40")
(timestamp 001B2480)
("Source Package" AT89C52_6)
(Value AT89C52))))
(component R2
(place R25
(property
("PCB Footprint" RES1)
(timestamp 00211635)
("Source Package" R2)
(Value 510)))
(place R26
(property
("PCB Footprint" RES1)
(timestamp 002118EE)
("Source Package" R2)
(Value 510)))
(place R27
(property
("PCB Footprint" RES1)
(timestamp 00211BA7)
("Source Package" R2)
(Value 510)))
(place R28
(property
("PCB Footprint" RES1)
(timestamp 0021322F)
("Source Package" R2)
(Value 10K)))
(place R29
(property
("PCB Footprint" RES1)
(timestamp 002133EE)
("Source Package" R2)
(Value 10K)))
(place R1
(property
("PCB Footprint" RES1)
(timestamp 002016C7)
("Source Package" R2)
(Value 1K)))
(place R2
(property
("PCB Footprint" RES1)
(timestamp 002018C5)
("Source Package" R2)
(Value 1K)))
(place R3
(property
("PCB Footprint" RES1)
(timestamp 00201AC3)
("Source Package" R2)
(Value 1K)))
(place R4
(property
("PCB Footprint" RES1)
(timestamp 00201CC1)
("Source Package" R2)
(Value 1K)))
(place R5
(property
("PCB Footprint" RES1)
(timestamp 0020F017)
("Source Package" R2)
(Value 10K)))
(place R6
(property
("PCB Footprint" RES1)
(timestamp 0020F36B)
("Source Package" R2)
(Value 10K)))
(place R7
(property
("PCB Footprint" RES1)
(timestamp 0020F624)
("Source Package" R2)
(Value 10K)))
(place R8
(property
("PCB Footprint" RES1)
(timestamp 0020F8DD)
("Source Package" R2)
(Value 10K)))
(place R9
(property
("PCB Footprint" RES1)
(timestamp 0020FB96)
("Source Package" R2)
(Value 10K)))
(place R10
(property
("PCB Footprint" RES1)
(timestamp 0020FE4F)
("Source Package" R2)
(Value 10K)))
(place R11
(property
("PCB Footprint" RES1)
(timestamp 00210108)
("Source Package" R2)
(Value 10K)))
(place R12
(property
("PCB Footprint" RES1)
(timestamp 002103C1)
("Source Package" R2)
(Value 10K)))
(place R13
(property
("PCB Footprint" RES1)
(timestamp 001B3305)
("Source Package" R2)
(Value 10k)))
(place R14
(property
("PCB Footprint" RES1)
(timestamp 001B3279)
("Source Package" R2)
(Value 100)))
(place R15
(property
("PCB Footprint" RES1)
(timestamp 001CD2C1)
("Source Package" R2)
(Value 510)))
(place R17
(property
("PCB Footprint" RES1)
(timestamp 001CD1B0)
("Source Package" R2)
(Value 100)))
(place R18
(property
("PCB Footprint" RES1)
(timestamp 00210817)
("Source Package" R2)
(Value 510)))
(place R20
(property
("PCB Footprint" RES1)
(timestamp 001CCE7D)
("Source Package" R2)
(Value 20k)))
(place R21
(property
("PCB Footprint" RES1)
(timestamp 001D91C7)
("Source Package" R2)
(Value 10)))
(place R22
(property
("PCB Footprint" RES1)
(timestamp 001CCF8E)
("Source Package" R2)
(Value 5k)))
(place R23
(property
("PCB Footprint" RES1)
(timestamp 001CD09F)
("Source Package" R2)
(Value 3.3k)))
(place R24
(property
("PCB Footprint" RES1)
(timestamp 0021147E)
("Source Package" R2)
(Value 510))))
(component "NPN BCE"
(place Q1
(property
("PCB Footprint" NPN)
(timestamp 001D594D)
("Source Package" "NPN BCE")
(Value 8050))))
(component ZTA
(place Y1
(property
("PCB Footprint" "XTAL1-5")
(timestamp 001B2F26)
("Source Package" ZTA)
(Value 11.0592M)))
(place Y2
(property
("PCB Footprint" "XTAL1-5")
(timestamp 0026718D)
("Source Package" ZTA)
(Value 32.768K))))
(component CON16
(place J14
(property
("PCB Footprint" CON16P)
(timestamp 00225F05)
("Source Package" CON16)
(Value LCD_CON16))))
(component "CAP NP"
(place C1
(property
("PCB Footprint" "CAP-NP-2.5")
(timestamp 001B2FBB)
("Source Package" "CAP NP")
(Value 30)))
(place C2
(property
("PCB Footprint" "CAP-NP-2.5")
(timestamp 001B3047)
("Source Package" "CAP NP")
(Value 30)))
(place C7
(property
("PCB Footprint" "CAP-NP-2.5")
(timestamp 0020C41F)
("Source Package" "CAP NP")
(Value 104)))
(place C11
(property
("PCB Footprint" "CAP-NP-2.5")
(timestamp 001CEEAC)
("Source Package" "CAP NP")
(Value 102)))
(place C12
(property
("PCB Footprint" "CAP-NP-2.5")
(timestamp 001CEFBE)
("Source Package" "CAP NP")
(Value 103)))
(place C13
(property
("PCB Footprint" "CAP-NP-2.5")
(timestamp 00267161)
("Source Package" "CAP NP")
(Value 30)))
(place C14
(property
("PCB Footprint" "CAP-NP-2.5")
(timestamp 00213AC3)
("Source Package" "CAP NP")
(Value 104)))
(place C15
(property
("PCB Footprint" "CAP-NP-2.5")
(timestamp 00267179)
("Source Package" "CAP NP")
(Value 30))))
(component "HOR-E10501GP"
(place U2
(property
("PCB Footprint" BS201)
(timestamp 001F4018)
("Source Package" "HOR-E10501GP")
(Value "HOR-E10501GP")))
(place U3
(property
("PCB Footprint" BS201)
(timestamp 001F41CF)
("Source Package" "HOR-E10501GP")
(Value "HOR-E10501GP")))
(place U4
(property
("PCB Footprint" BS201)
(timestamp 001F4386)
("Source Package" "HOR-E10501GP")
(Value "HOR-E10501GP")))
(place U5
(property
("PCB Footprint" BS201)
(timestamp 001F453D)
("Source Package" "HOR-E10501GP")
(Value "HOR-E10501GP"))))
(component DS1302_3
(place U14
(property
("PCB Footprint" "DIP-8")
(timestamp 0026711D)
("Source Package" DS1302_3)
(Value DS1302))))
(component DIODE_0
(place D2
(property
("PCB Footprint" DIODE)
(timestamp 0020C3A7)
("Source Package" DIODE_0)
(Value IN4001))))
(component LED
(place D1
(property
("PCB Footprint" "LED-2.54")
(timestamp 001D55CF)
("Source Package" LED)
(Value LED)))
(place D5
(property
("PCB Footprint" "LED-2.54")
(timestamp 001D56FA)
("Source Package" LED)
(Value LED)))
(place D6
(property
("PCB Footprint" "LED-2.54")
(timestamp 001E22B2)
("Source Package" LED)
(Value LED)))
(place D7
(property
("PCB Footprint" "LED-2.54")
(timestamp 001E216B)
("Source Package" LED)
(Value LED)))
(place D8
(property
("PCB Footprint" "LED-2.54")
(timestamp 001E2024)
("Source Package" LED)
(Value LED)))
(place D9
(property
("PCB Footprint" "LED-2.54")
(timestamp 001E1EDD)
("Source Package" LED)
(Value LED))))
(component CON8
(place J1
(property
("PCB Footprint" CON8P)
(timestamp 001C76DF)
("Source Package" CON8)
(Value CON8)))
(place J2
(property
("PCB Footprint" CON8P)
(timestamp 001C7642)
("Source Package" CON8)
(Value CON8)))
(place J3
(property
("PCB Footprint" CON8P)
(timestamp 001C75A5)
("Source Package" CON8)
(Value CON8)))
(place J4
(property
("PCB Footprint" CON8P)
(timestamp 001C7508)
("Source Package" CON8)
(Value CON8))))
(component "CONNECTOR DB9"
(place P1
(property
("PCB Footprint" "DB9-HF")
(timestamp 0023157A)
("Source Package" "CONNECTOR DB9")
(Value "CONNECTOR-DB9"))))
(component 74HC164_1
(place U6
(property
("PCB Footprint" "DIP-14")
(timestamp 001F6B2E)
("Source Package" 74HC164_1)
(Value 74HC164)))
(place U7
(property
("PCB Footprint" "DIP-14")
(timestamp 001F70D1)
("Source Package" 74HC164_1)
(Value 74HC164)))
(place U8
(property
("PCB Footprint" "DIP-14")
(timestamp 001F6EF0)
("Source Package" 74HC164_1)
(Value 74HC164)))
(place U9
(property
("PCB Footprint" "DIP-14")
(timestamp 001F6D0F)
("Source Package" 74HC164_1)
(Value 74HC164))))
(component NE555
(place U11
(property
("PCB Footprint" "DIP-8")
(timestamp 001CCB61)
("Source Package" NE555)
(Value NE555))))
(component LED_0
(place D3
(property
("PCB Footprint" "LED-2.54")
(timestamp 0020C3D3)
("Source Package" LED_0)
(Value LED))))
(component LED_1
(place D4
(property
("PCB Footprint" "LED-2.54")
(timestamp 002314AA)
("Source Package" LED_1)
(Value LED))))
(component "RESISTOR VAR"
(place RP1
(property
("PCB Footprint" RESP)
(timestamp 00225ED5)
("Source Package" "RESISTOR VAR")
(Value 2K)))
(place RP2
(property
("PCB Footprint" RESP)
(timestamp 001CD4E0)
("Source Package" "RESISTOR VAR")
(Value 10K))))
(component "SW TACT-SPST/SM"
(place SW1
(property
("PCB Footprint" SW)
(timestamp 001CD5FA)
("Source Package" "SW TACT-SPST/SM")
(Value RES)))
(place SW2
(property
("PCB Footprint" SW)
(timestamp 001E19B8)
("Source Package" "SW TACT-SPST/SM")
(Value "SW TACT-SPST/SM")))
(place SW3
(property
("PCB Footprint" SW)
(timestamp 001E1AFF)
("Source Package" "SW TACT-SPST/SM")
(Value "SW TACT-SPST/SM")))
(place SW4
(property
("PCB Footprint" SW)
(timestamp 001E1C46)
("Source Package" "SW TACT-SPST/SM")
(Value "SW TACT-SPST/SM")))
(place SW5
(property
("PCB Footprint" SW)
(timestamp 001E1D8D)
("Source Package" "SW TACT-SPST/SM")
(Value "SW TACT-SPST/SM"))))
(component CON10
(place J22
(property
("PCB Footprint" "CON-ISP")
(timestamp 0026CB06)
("Source Package" CON10)
(Value CON10))))
(component CAP
(place C3
(property
("PCB Footprint" "CAP-2.5")
(timestamp 001B30DC)
("Source Package" CAP)
(Value 10u/50V)))
(place C4
(property
("PCB Footprint" "CAP-2.5")
(timestamp 002315AA)
("Source Package" CAP)
(Value 1uf)))
(place C5
(property
("PCB Footprint" "CAP-2.5")
(timestamp 0023158A)
("Source Package" CAP)
(Value 1uf)))
(place C6
(property
("PCB Footprint" "CAP-2.5")
(timestamp 0020C2EB)
("Source Package" CAP)
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