6225_mt6601_20070510_orcad9_2007_11.onl

MT6225全部的硬件电路资料

(PCB 6225_MT6601_20070510_ORCAD9_2007_11
 (description
  (timeStamp "2009 03 04 08 58 51")
  (program "CAPTURE.EXE" (Version "9.00.1153 CIS"))
  (source "Original data from OrCAD/CAPTURE schematic")
  (title "MT6225")
  (date "Thursday, November 29, 2007")
  (document "I:\\CHIP\\MT6225 FULL_SET REFERENCE PHONE\\6225_MT6601_20070510_ORCAD9_2007_11.DSN")
  (revision "")
  (organization "")
  (address1 "")
  (address2 "")
  (address3 "")
  (address4 "")
  (partvaluecombine "{Value}")
  (pcbfootprintcombine "{PCB Footprint}"))
 (structure )
 (placement
  (component MICROPHONE
   (place J201
    (property 
     ("PCB Footprint" "MIC(OBF215-40P13C1033)")
     (timestamp 0112346A)
     (Function MIC)
     (Vendor CST)
     ("Source Package" MICROPHONE)
     (Value Microphone)
     (PN "OBF215-40P13C1033")
     (Description "Hit hm060-eo2nc"))))
  (component TST_PORT_0
   (place J700
    (property 
     ("PCB Footprint" "MM8430-2600B")
     (timestamp 00F9A9AE)
     (Vendor MURATA)
     ("Source Package" TST_PORT_0)
     (Value "MM8430-2600B")
     (PN "MM8430-2600B")
     (Description "MM8430-2600B")))
   (place J600
    (property 
     ("PCB Footprint" "MM8430-2600B")
     (timestamp 010B49F2)
     (Vendor HRS)
     ("Source Package" TST_PORT_0)
     (Value carkit)
     (PN "MS-156")
     (Description "MS-156"))))
  (component RESARR_IS_1
   (place CM500
    (property 
     ("PCB Footprint" NUF8401MN)
     (timestamp 0118007D)
     (Vendor "ON SEMI")
     (Function CAMERA)
     ("Source Package" RESARR_IS_1)
     (Value NUF8401MN)
     (PN "NUF8401MN-D")))
   (place CM501
    (property 
     ("PCB Footprint" NUF8401MN)
     (timestamp 0105EB9C)
     (Function CAMERA)
     (Vendor "ON SEMI")
     ("Source Package" RESARR_IS_1)
     (Value NUF8401MN)
     (PN "NUF8401MN-D")))
   (place CM502
    (property 
     ("PCB Footprint" NUF8401MN)
     (timestamp 0100E722)
     (Function CAMERA)
     (Vendor "ON SEMI")
     ("Source Package" RESARR_IS_1)
     (Value NUF8401MN)
     (PN "NUF8401MN-D"))))
  (component BATTERY_1
   (place C425
    (property 
     ("PCB Footprint" "XH414H-II02E")
     (timestamp 008BAB27)
     (Vendor "SII Micro")
     ("Source Package" BATTERY_1)
     (Value XH414H)
     (PN XH414H)
     (Description "PAS414R-S-VE5R"))))
  (component "MOTOR STEPPER"
   (place U405
    (property 
     ("PCB Footprint" "VIB(DM-YK407-5)")
     (timestamp 0103C5CF)
     (Vendor "HENGDIAN DMEGC MAGNETICS")
     ("Source Package" "MOTOR STEPPER")
     (Value "DC VIBRATOR")
     (PN "DM-YK407-5"))))
  (component FUSE
   (place F401
    (property 
     ("PCB Footprint" 0603)
     (timestamp 004C97EF)
     (Vendor BUSSMANN)
     ("Source Package" FUSE)
     (Value "FUSE(1A 0603)")
     (PN "TR/1608FF-1A")
     (Description "Fuse 1A 0603"))))
  (component RF3140_0
   (place U602
    (property 
     ("PCB Footprint" PF08151B)
     (timestamp 0118619D)
     (Vendor RENESAS)
     ("Source Package" RF3140_0)
     (Value PF08155B)
     (PN PF08155B)
     (Description PA))))
  (component "LANAI-CTBGA-132_50"
   (place U700
    (property 
     ("Part Description" "IC, RFIC, BLUETOOTH RADIO PROCESSOR, VFBGA96")
     ("PCB Footprint" "TFBGA70/P0.5/B0.32(5X5)")
     (timestamp 008F0217)
     ("SiWAVE P/N" SiW3500GIP1)
     ("Manufacturer Part Number" MT6601)
     ("Source Package" "LANAI-CTBGA-132_50")
     (Manufacturer MTK)
     (Value SiW3500GIP1))))
  (component "DIODE SCHOTTKY_2"
   (place D403
    (property 
     (SPEC. "ROHM-SCHOTTKY DIODE-0.5A")
     ("PCB Footprint" sod323)
     (timestamp 010B2850)
     ("Source Package" "DIODE SCHOTTKY_2")
     (Value BAT165))))
  (component THERMISTER2
   (place TR100
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0105960C)
     (Function "BB chip")
     ("Source Package" THERMISTER2)
     (Value NTC))))
  (component R_0402
   (place R604
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01191173)
     (Vendor MURATA)
     ("Source Package" R_0402)
     (Value BLM15BB750SN1)
     (Description BLM15BB750SN1)))
   (place R605
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0118B627)
     ("Source Package" R_0402)
     (Value 0ohm)))
   (place R606
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01186448)
     (Vendor MURATA)
     ("Source Package" R_0402)
     (Value BLM15BB750SN1)
     (Description BLM15BB750SN1)))
   (place R607
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0118617E)
     (Vendor MURATA)
     ("Source Package" R_0402)
     (Value BLM15BB750SN1)
     (Description BLM15BB750SN1)))
   (place R608
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01186382)
     (Vendor CYNTEC)
     ("Source Package" R_0402)
     (Value 10)
     (Description "R 10 J 1/16W 0402")))
   (place R700
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00F9BC9F)
     ("Source Package" R_0402)
     (Value 47K)
     (Description "R 10K J 1/16W 0402")))
   (place R702
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FA6A87)
     ("Source Package" R_0402)
     (Value 390)
     (Description "R 10K J 1/16W 0402")))
   (place R703
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0101CAD4)
     ("Source Package" R_0402)
     (Value NC)
     (Description "R 10K J 1/16W 0402")))
   (place R704
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01134BF0)
     ("Source Package" R_0402)
     (Value "0 ohm")
     (Description "R 10K J 1/16W 0402")))
   (place R705
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0115360A)
     ("Source Package" R_0402)
     (Value "0 ohm")
     (Description "R 10K J 1/16W 0402"))))
  (component MT6227_26
   (place U100
    (property 
     ("PCB Footprint" "MT6225-264/P0.65/B0.3(12X12)")
     (timestamp 00E4E52A)
     (Vendor MTK)
     ("Source Package" MT6227_26)
     (Value MT6225)
     (PN MT6225))))
  (component ESD
   (place ESD500
    (property 
     ("PCB Footprint" SPARK)
     (timestamp 011089FF)
     (Function "Touch Panel")
     ("Source Package" ESD)
     (Value ESD)))
   (place ESD501
    (property 
     ("PCB Footprint" SPARK)
     (timestamp 011089F2)
     (Function "Touch Panel")
     ("Source Package" ESD)
     (Value ESD)))
   (place ESD502
    (property 
     ("PCB Footprint" SPARK)
     (timestamp 01108A5A)
     (Function "Touch Panel")
     ("Source Package" ESD)
     (Value ESD)))
   (place ESD503
    (property 
     ("PCB Footprint" SPARK)
     (timestamp 01108A7D)
     (Function "Touch Panel")
     ("Source Package" ESD)
     (Value ESD)))
   (place ESD300
    (property 
     ("PCB Footprint" SPARK)
     (timestamp 0108C741)
     ("Source Package" ESD)
     (Value ESD)))
   (place ESD301
    (property 
     ("PCB Footprint" SPARK)
     (timestamp 0108C75A)
     ("Source Package" ESD)
     (Value ESD)))
   (place ESD302
    (property 
     ("PCB Footprint" "SPARK ")
     (timestamp 00FFF251)
     ("Source Package" ESD)
     (Value ESD)))
   (place ESD303
    (property 
     ("PCB Footprint" SPARK)
     (timestamp 00FFF577)
     ("Source Package" ESD)
     (Value ESD)))
   (place ESD304
    (property 
     ("PCB Footprint" SPARK)
     (timestamp 00FFF09D)
     ("Source Package" ESD)
     (Value ESD)))
   (place ESD305
    (property 
     ("PCB Footprint" SPARK)
     (timestamp 00FFF97F)
     ("Source Package" ESD)
     (Value ESD)))
   (place ESD306
    (property 
     ("PCB Footprint" SPARK)
     (timestamp 00FFF49D)
     ("Source Package" ESD)
     (Value ESD))))
  (component VCE
   (place T401
    (property 
     ("PCB Footprint" 0603)
     (timestamp 00FF7E59)
     ("Source Package" VCE)
     (Value VCE)
     (Description "MLV SMD (0603,Vrms 14V. 10%)")))
   (place T402
    (property 
     ("PCB Footprint" 0603)
     (timestamp 00FF7B8B)
     ("Source Package" VCE)
     (Value VCE)
     (Description "MLV SMD (0603,Vrms 14V. 10%)")))
   (place T403
    (property 
     ("PCB Footprint" 0603)
     (timestamp 00FF7EEE)
     ("Source Package" VCE)
     (Value VCE)
     (Description "MLV SMD (0603,Vrms 14V. 10%)")))
   (place T300
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0108C750)
     ("Source Package" VCE)
     (Value VCE)
     (Description MLVS0402M07)))
   (place T301
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0108C748)
     ("Source Package" VCE)
     (Value VCE)
     (Description MLVS0402M07)))
   (place T302
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FFE671)
     ("Source Package" VCE)
     (Value VCE)
     (Description MLVS0402M07)))
   (place T303
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FFF781)
     ("Source Package" VCE)
     (Value VCE)
     (Description MLVS0402M07)))
   (place T304
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FFF527)
     ("Source Package" VCE)
     (Value VCE)
     (Description MLVS0402M07)))
   (place T305
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FFF04B)
     ("Source Package" VCE)
     (Value VCE)
     (Description MLVS0402M07)))
   (place T306
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FFF3CF)
     ("Source Package" VCE)
     (Value VCE)
     (Description MLVS0402M07)))
   (place T201
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01123734)
     (Function MIC)
     (Vendor INPAQ)
     ("Source Package" VCE)
     (Value "VCE(22p)")))
   (place T202
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FB72E2)
     ("Source Package" VCE)
     (Value VCE)))
   (place T203
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FB7047)
     ("Source Package" VCE)
     (Value VCE)))
   (place T204
    (property 
     ("PCB Footprint" 0402)
     (timestamp 011236B0)
     (Function MIC)
     (Vendor INPAQ)
     ("Source Package" VCE)
     (Value "VCE(22p)")))
   (place T205
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FB6A08)
     ("Source Package" VCE)
     (Value VCE)))
   (place T206
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FB6A60)
     ("Source Package" VCE)
     (Value VCE)))
   (place T207
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00FB68E5)
     ("Source Package" VCE)
     (Value VCE)))
   (place T208
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01167475)
     ("Source Package" VCE)
     (Value VCE)))
   (place T209
    (property 
     ("PCB Footprint" 0402)
     (timestamp 011673A6)
     ("Source Package" VCE)
     (Value VCE)
     (Description MLVS0402M07)))
   (place T210
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01167371)
     ("Source Package" VCE)
     (Value "VCE (MLVS 0402 M07)")))
   (place T211
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0106976E)
     ("Source Package" VCE)
     (Value "VCE (MLVS 0402 M07)")))
   (place T212
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0116743E)
     ("Source Package" VCE)
     (Value "VCE (MLVS 0402 M07)")))
   (place T500
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01108A65)
     (Function "Touch Panel")
     (Vendor INPAQ)
     ("Source Package" VCE)
     (Value "VCE(22p)")))
   (place T501
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01108A36)
     (Function "Touch Panel")
     (Vendor INPAQ)
     ("Source Package" VCE)
     (Value "VCE(22p)")))
   (place T213
    (property 
     ("PCB Footprint" 0402)
     (timestamp 010697F8)
     ("Source Package" VCE)
     (Value "VCE (MLVS 0402 M07)")))
   (place T502
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01108A2A)
     (Function "Touch Panel")
     (Vendor INPAQ)
     ("Source Package" VCE)
     (Value "VCE(22p)")))
   (place T503
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01108A71)
     (Function "Touch Panel")
     (Vendor INPAQ)
     ("Source Package" VCE)
     (Value "VCE(22p)"))))
  (component "CAP NP"
   (place C211
    (property 
     ("PCB Footprint" 0402)
     (timestamp 011672C7)
     ("Source Package" "CAP NP")
     (Material C0G)
     (Value 100p)
     (Description "C 100p 16V J 0402 C0G")))
   (place C500
    (property 
     ("PCB Footprint" 0603)
     (timestamp 00FEEAC6)
     (Vendor MURUTA)
     ("Source Package" "CAP NP")
     (Material X5R)
     (Value "2.2U (0603 X5R 6.3V)")
     (PN GRM39X5R225K6.3H530)
     (Description "C 2.2u 6.3V K 0603 X5R")))
   (place C212
    (property 
     ("PCB Footprint" 0402)