des0209_11_sch_10.onl

一个POWERPC的原理图,包括ORCAD格式的原理图等

(PCB DES0209_11_SCH_10
 (description
  (timeStamp "2005 06 02 18 39 35")
  (program "CAPTURE.EXE" (Version "10.3.0.p001"))
  (source "Original data from OrCAD/CAPTURE schematic")
  (title "Des0209_11")
  (date "Thursday, June 02, 2005")
  (document "Des0209_11_sch_10")
  (revision "1.1")
  (organization "")
  (address1 "")
  (address2 "")
  (address3 "")
  (address4 "")
  (partvaluecombine "{Value}")
  (pcbfootprintcombine "{PCB Footprint}"))
 (structure )
 (placement
  (component CON_RJ45_1X8_F_RA_2BILEDYG
   (place J8
    (property 
     ("MFGI 1#" "Tyco: 1116075-8")
     ("Board Option" Base)
     ("PCB Footprint" RJ45_8POS)
     (timestamp 01514DAA)
     ("MFG 3#" "Xmultiple:  XRJ-S-01-B-0-8-F2")
     ("MFG 2#" "Amphenol: RJHS-538A")
     ("MFG 1#" "Tyco: 1116075-8")
     ("Source Package" CON_RJ45_1X8_F_RA_2BILEDYG)
     (Cost 1.35)
     (CETEC "1116075-8   or  RJHS538A")
     (Package RJ45_8)
     (Value RJ45/1X8/BILED)
     (SHAPE RJ45_8POS)))
   (place J9
    (property 
     ("MFGI 1#" "Tyco: 1116075-8")
     ("Board Option" Base)
     ("PCB Footprint" RJ45_8POS)
     (timestamp 01516A56)
     ("MFG 3#" "Xmultiple:  XRJ-S-01-B-0-8-F2")
     ("MFG 2#" "Amphenol: RJHS-538A")
     ("MFG 1#" "Tyco: 1116075-8")
     ("Source Package" CON_RJ45_1X8_F_RA_2BILEDYG)
     (Cost 1.35)
     (CETEC "1116075-8   or  RJHS538A")
     (Package RJ45_8)
     (Value RJ45/1X8/BILED)
     (SHAPE RJ45_8POS))))
  (component DIODE_SCHOTTKY_SMB_1A_20V
   (place D1
    (property 
     ("MFGI 1#" "On Semi MBRS120T3")
     ("Board Option" Base)
     ("PCB Footprint" SMB_DIODE)
     (timestamp 00E74D1E)
     ("MFG 2#" "Motorola MURS120T3")
     ("MFG 1#" "On Semi MBRS120T3")
     ("Source Package" DIODE_SCHOTTKY_SMB_1A_20V)
     (Cost .0670)
     (CETEC MURS120T3)
     (Value MURS120T3)
     (Shape SMB)
     ("MFGI 2#" "Motorola MURS120T3")))
   (place D2
    (property 
     ("MFGI 1#" "On Semi MBRS120T3")
     ("Board Option" Base)
     ("PCB Footprint" SMB_DIODE)
     (timestamp 00E74F0C)
     ("MFG 2#" "Motorola MURS120T3")
     ("MFG 1#" "On Semi MBRS120T3")
     ("Source Package" DIODE_SCHOTTKY_SMB_1A_20V)
     (Cost .0670)
     (CETEC MURS120T3)
     (Value MURS120T3)
     (Shape SMB)
     ("MFGI 2#" "Motorola MURS120T3"))))
  (component RES_78r7K_0402_1%
   (place R11
    (property 
     ("MFGI 1#" "Yaego 9C04021A7872Fxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 0176E5CE)
     ("MFG 2#" "Bourns CR0402Fx7872x")
     ("MFG 1#" "Yaego 9C04021A7872Fxxxx")
     ("Source Package" RES_78r7K_0402_1%)
     (Cost .009)
     (Value 78.7K,1%)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Fx7872x"))))
  (component CAP_2r2UF_0805_25V_10%_X7R
   (place C7
    (property 
     ("MFGI 1#" "AVX 08053C225KAxxA")
     ("Board Option" Base)
     ("PCB Footprint" C_0805_IPC)
     (timestamp 00E78181)
     ("MFG 2#" "Kemet C0805C225K3RAC")
     ("MFG 1#" "AVX 08053C225KAxxA")
     (Type X7R)
     ("Source Package" CAP_2r2UF_0805_25V_10%_X7R)
     (Cost .02)
     (CETEC None)
     (Value 2.2uF)
     (Shape 0805)
     ("MFGI 2#" "Kemet C0805C225K3RAC")))
   (place C47
    (property 
     ("MFGI 1#" "AVX 08053C225KAxxA")
     ("Board Option" Base)
     ("PCB Footprint" C_0805_IPC)
     (timestamp 00E7D56C)
     ("MFG 2#" "Kemet C0805C225K3RAC")
     ("MFG 1#" "AVX 08053C225KAxxA")
     (Type X7R)
     ("Source Package" CAP_2r2UF_0805_25V_10%_X7R)
     (Cost .02)
     (CETEC None)
     (Value 2.2uF)
     (Shape 0805)
     ("MFGI 2#" "Kemet C0805C225K3RAC"))))
  (component FUSE_500MA_1210_SMT
   (place F1
    (property 
     ("MFGI 1#" "Bourns: MF-USMD050")
     ("Board Option" 440EP)
     ("PCB Footprint" FU_1210)
     (timestamp 012283BC)
     ("MFG 2#" "Tyco/Raychem: NANOSMDM050F/13.2")
     ("MFG 1#" "Bourns: MF-USMD050")
     ("Source Package" FUSE_500MA_1210_SMT)
     (Cost .71)
     (Value FUSE_500MA_1210_SMT)
     (SHAPE 500mA)
     ("MFGI 2#" "Tyco/Raychem: NANOSMDM050F/13.2")))
   (place F7
    (property 
     ("MFGI 1#" "Bourns: MF-USMD050")
     ("Board Option" Base)
     ("PCB Footprint" FU_1210)
     (timestamp 01521349)
     ("MFG 2#" "Tyco/Raychem: NANOSMDM050F/13.2")
     ("MFG 1#" "Bourns: MF-USMD050")
     ("Source Package" FUSE_500MA_1210_SMT)
     (Cost .71)
     (Value FUSE_500MA_1210_SMT)
     (SHAPE 500mA)
     ("MFGI 2#" "Tyco/Raychem: NANOSMDM050F/13.2"))))
  (component "REG_SW_SOT23-5_LT1935"
   (place U6
    (property 
     ("MFGI 1#" "Linear Tech: LT1935ES5")
     ("Board Option" Base)
     ("PCB Footprint" SOT_23_5)
     (timestamp 00E74FAC)
     ("MFG 1#" "Linear Tech: LT1935ES5")
     ("Source Package" "REG_SW_SOT23-5_LT1935")
     (Cost 2.44)
     (Value LT1935ES5)
     (SHAPE "SOT23-5"))))
  (component IC_FETH_LQFP48_SINGLE_KS8721BL
   (place U21
    (property 
     ("MFGI 1#" "Micrel: KS8721BLI")
     ("Board Option" Base)
     ("PCB Footprint" "QFP50P-48T")
     (timestamp 012B88AC)
     ("MFG 1#" "Micrel: KS8721BL")
     ("Source Package" IC_FETH_LQFP48_SINGLE_KS8721BL)
     (Cost 2.36)
     (Value KS8721BL)
     (SHAPE LQFP48)))
   (place U22
    (property 
     ("MFGI 1#" "Micrel: KS8721BLI")
     ("Board Option" Base)
     ("PCB Footprint" "QFP50P-48T")
     (timestamp 01323DC2)
     ("MFG 1#" "Micrel: KS8721BL")
     ("Source Package" IC_FETH_LQFP48_SINGLE_KS8721BL)
     (Cost 2.36)
     (Value KS8721BL)
     (SHAPE LQFP48))))
  (component RES_10_0805_5%
   (place R1
    (property 
     ("MFGI 1#" "Yaego 9C08052A10R0Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0805_IPC)
     (timestamp 00E7806B)
     ("MFG 2#" "Bourns CR0805Jx100x")
     ("MFG 1#" "Yaego 9C08052A10R0Jxxxx")
     ("Source Package" RES_10_0805_5%)
     (Cost .0032)
     (CETEC 9C08052A10R0JLR)
     (Value 10)
     (Shape 0805)
     ("MFGI 2#" "Bourns CR0805Jx100x"))))
  (component RES_3r3K_0402_5%
   (place R58
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 017A234D)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R26
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 01354466)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R59
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 017A276D)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R27
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 00E93962)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R160
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 017DADF2)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R161
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 018F3157)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R28
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 00E92DCA)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R29
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 00E92E72)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R107
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 017BBDBE)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R92
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 014F2F42)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R60
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 017A193D)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R61
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 017A2763)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R93
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 017BB42A)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R62
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 013574AB)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R30
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 00E92FA4)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R63
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 017A2999)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R64
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 017A298F)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")
     ("Source Package" RES_3r3K_0402_5%)
     (Cost .0032)
     (CETEC 9C04022A3301JLR)
     (Value 3.3K)
     (Shape 0402)
     ("MFGI 2#" "Bourns CR0402Jx332x")))
   (place R65
    (property 
     ("MFGI 1#" "Yaego 9C04021A3301Jxxxx")
     ("Board Option" Base)
     ("PCB Footprint" R_0402_IPC)
     (timestamp 01358612)
     ("MFG 2#" "Bourns CR0402Jx332x")
     ("MFG 1#" "Yaego 9C04021A3301Jxxxx")