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📄 convect.txt

📁 ansys.com上的ansys命令流,主要为热,流体,接触分析方面的内容
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!
/prep7				! re-enter preprocessor
allsel				! select everything
lsclear,all			! delete all loads and constraints
!
mptemp				! delete temp tables
mpdele,all,20			! delete conv+rad h vs. temp tables for pkg and pcb surfaces
mpdele,all,21
mpdele,all,22
!
esel,s,mat,,sili		! apply heat flux to chip
nsle
nsel,r,loc,z,hdie+zdie
sf,all,hflux,pwr/(xdie1*ydie1)
!
! free = 0, free convection
!      = 1, forced convection (need velocity predefined)
!
*if,free,eq,0,then		! check for free convection run
!
!  FREE CONVECTION DEFINITION (UPPER PKG SURFACE)
!
! jedec = 2, 2-layer (2S0P) JEDEC PWB
!       = 4, 4-layer (2S2P) JEDEC PWB
!
*if,jedec,eq,2,then		! create isothermal conv+rad h table for upper pkg surface
mptemp
p=(xbody*ybody/(2*(xbody+ybody)))*1e-03
*do,i,tamb,tamb+200,5
  hcon=1.336*((i-tamb)/p)**0.25
  hrad=epkg*5.67e-08*((i+273)+(tamb+273))*((i+273)**2+(tamb+273)**2)
  htot=(hcon+hrad)*1e-06
  mptemp,,i
  mpdata,hf,20,,htot
*enddo
*endif
!
*if,jedec,eq,4,then		! create dual isoflux conv+rad h table for upper pkg surface
mptemp
p=(xbody*ybody/(2*(xbody+ybody)))*1e-03
q=pwr/((2*xpkg*ypkg)*1e-06)
*do,i,tamb,tamb+200,5
  hcon=0.551*(q**0.185)/(p**0.260)
  hrad=epkg*5.67e-08*((i+273)+(tamb+273))*((i+273)**2+(tamb+273)**2)
  htot=(hcon+hrad)*1e-06
  mptemp,,i
  mpdata,hf,20,,htot
*enddo
*endif
!
!  FREE CONVECTION DEFINITION (UPPER PCB SURFACE)
!
*if,jedec,eq,2,then			! create isothermal conv+rad h table for upper pwb surface
mptemp
p=(xpwb1*ypwb1/(2*(xpwb1+ypwb1)))*1e-03
*do,i,tamb,tamb+200,5
  hcon=1.336*((i-tamb)/p)**0.25
  hrad=epwb*5.67e-08*((i+273)+(tamb+273))*((i+273)**2+(tamb+273)**2)
  htot=(hcon+hrad)*1e-06
  mptemp,,i
  mpdata,hf,21,,htot
*enddo
*endif
!
*if,jedec,eq,4,then			! create dual isoflux conv+rad h table for upper pwb surface
mptemp
p=(xpwb1*ypwb1/(2*(xpwb1+ypwb1)))*1e-03
q=pwr/((2*xpwb1*ypwb1)*1e-06)
*do,i,tamb,tamb+200,5
  hcon=0.551*(q**0.185)/(p**0.260)
  hrad=epwb*5.67e-08*((i+273)+(tamb+273))*((i+273)**2+(tamb+273)**2)
  htot=(hcon+hrad)*1e-06
  mptemp,,i
  mpdata,hf,21,,htot
*enddo
*endif
!
!  FREE CONVECTION DEFINITION (LOWER PWB SURFACE)
!
*if,jedec,eq,2,then	! create isothermal conv+rad h table for lower pwb surface
mptemp
p=(xpwb1*ypwb1/(2*(xpwb1+ypwb1)))*1e-03
*do,i,tamb,tamb+200,5
  hcon=0.668*((i-tamb)/p)**0.25
  hrad=epwb*5.67e-08*((i+273)+(tamb+273))*((i+273)**2+(tamb+273)**2)
  htot=(hcon+hrad)*1e-06
  mptemp,,i
  mpdata,hf,22,,htot
*enddo
*endif
!
*if,jedec,eq,4,then	! create dual isoflux conv+rad h table for lower pwb surface
mptemp
p=(xpwb1*ypwb1/(2*(xpwb1+ypwb1)))*1e-03
q=pwr/((2*xpwb1*ypwb1)*1e-06)
*do,i,tamb,tamb+200,5
  hcon=0.520*(q**0.166)/(p**0.336)
  hrad=epwb*5.67e-08*((i+273)+(tamb+273))*((i+273)**2+(tamb+273)**2)
  htot=(hcon+hrad)*1e-06
  mptemp,,i
  mpdata,hf,22,,htot
*enddo
*endif
!
*elseif,free,eq,1,then			! check for forced convection run
!
!  FORCED CONVECTION DEFINITION
!
! Characteristic Length of PKG & PCB
!
!cpkg=((xbody**2+ybody**2)**0.5)*1e-3
!cpwb=((xpwb1**2+ypwb1**2)**0.5)*1e-3
cpkg=ybody*1e-3
cpwb=ypwb1*1e-3
!
mptemp
htot=(5.289*(velocity/cpkg)**0.5)*1e-6
mptemp,,tamb
mpdata,hf,20,,htot	! h for upper pkg surface
!
mptemp
htot=(5.289*(velocity/cpwb)**0.5)*1e-6
mptemp,,tamb
mpdata,hf,21,,htot	! h for upper pwb surface
!
mptemp
htot=(5.289*(velocity/cpwb)**0.5)*1e-6
mptemp,,tamb
mpdata,hf,22,,htot	! h for lower pwb surface
!
*endif
*if,free,le,1,then
!
!  FREE & FORCED CONVECTION APPLICATION
!
nsel,s,loc,z,hpkg	! apply h to upper pkg surface
esln,s,0
nsle
nsel,r,loc,z,hpkg
sf,all,conv,-20,tamb
nsel,s,loc,z,hcop+zcop
sf,all,conv,-20,tamb
nsel,s,loc,z,zpwb 	! apply h to upper pwb surface
esln,s,0
nsle
nsel,r,loc,z,zpwb
sf,all,conv,-21,tamb
nsel,s,loc,z,0		! apply h to lower pwb surface
esln,s,0
nsle
nsel,r,loc,z,0
sf,all,conv,-22,tamb
fini
*endif

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