Eclipse Rich Client Platform Designing Coding and packaging Java Applications的源代码
标签： Applications Designing packaging Platform
上传时间： 2015-05-11
上传用户：change0329
Eclipse Rich Client Platform Designing Coding and packaging Java Applications.chm Elipse RCP 开发指南
标签： Applications Designing packaging Platform
上传时间： 2013-12-29
上传用户：xieguodong1234
As economy explodesand packaging industry lfourishes，itisacriticalissue thatinternational communityencountersthewasteofresourcesandenvironmentalpollution causedbypackaging waste．
标签： explodesand lfourishes packaging industry
上传时间： 2017-01-01
上传用户：xg262122
模拟集成电路的设计与其说是一门技术，还不如说是一门艺术。它比数字集成电路设计需要更严格的分析和更丰富的直觉。严谨坚实的理论无疑是严格分析能力的基石，而设计者的实践经验无疑是诞生丰富直觉的源泉。这也正足初学者对学习模拟集成电路设计感到困惑并难以驾驭的根本原因。.美国加州大学洛杉机分校(UCLA)Razavi教授凭借着他在美国多所著名大学执教多年的丰富教学经验和在世界知名顶级公司(AT&T，Bell Lab，HP)卓著的研究经历为我们提供了这本优秀的教材。本书自2000午出版以来得到了国内外读者的好评和青睐，被许多国际知名大学选为教科书。同时，由于原著者在世界知名顶级公司的丰富研究经历，使本书也非常适合作为CMOS模拟集成电路设计或相关领域的研究人员和工程技术人员的参考书。... 本书介绍模拟CMOS集成电路的分析与设计。从直观和严密的角度阐述了各种模拟电路的基本原理和概念，同时还阐述了在SOC中模拟电路设计遇到的新问题及电路技术的新发展。本书由浅入深，理论与实际结合，提供了大量现代工业中的设计实例。全书共18章。前10章介绍各种基本模块和运放及其频率响应和噪声。第11章至第13章介绍带隙基准、开关电容电路以及电路的非线性和失配的影响，第14、15章介绍振荡器和锁相环。第16章至18章介绍MOS器件的高阶效应及其模型、CMOS制造工艺和混合信号电路的版图与封装。 1 Introduction to Analog Design 2 Basic MOS Device Physics 3 Single-Stage Amplifiers 4 Differential Amplifiers 5 Passive and Active Current Mirrors 6 Frequency Response of Amplifiers 7 Noise 8 Feedback 9 Operational Amplifiers 10 Stability and Frequency Compensation 11 Bandgap References 12 Introduction to Switched-Capacitor Circuits 13 Nonlinearity and Mismatch 14 Oscillators 15 Phase-Locked Loops 16 Short-Channel Effects and Device Models 17 CMOS Processing Technology 18 Layout and packaging
上传时间： 2014-12-23
上传用户：杜莹12345
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
上传时间： 2013-10-10
上传用户：1184599859
The PCA9534 is a 16-pin CMOS device that provide 8 bits of General Purpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements include higher drive capability, 5 V I/O tolerance, lower supply current, individual I/O configuration, 400 kHz clock frequency, and smaller packaging. I/O expanders provide a simple solution when additional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc.
上传时间： 2013-11-17
上传用户：vodssv
The PCA9534 is a 16-pin CMOS device that provide 8 bits of General Purpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements include higher drive capability, 5 V I/O tolerance, lower supply current, individual I/O configuration, 400 kHz clock frequency, and smaller packaging. I/O expanders provide a simple solution when additional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc.
上传时间： 2013-10-10
上传用户：inwins
The PCA9535 and PCA9535C are 24-pin CMOS devices that provide 16 bits of GeneralPurpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and wasdeveloped to enhance the NXP Semiconductors family of I2C-bus I/O expanders. Theimprovements include higher drive capability, 5 V I/O tolerance, lower supply current,individual I/O configuration, and smaller packaging. I/O expanders provide a simplesolution when additional I/O is needed for ACPI power switches, sensors, push buttons,LEDs, fans, etc.
上传时间： 2013-10-21
上传用户：爱死爱死
The PCA9555 is a 24-pin CMOS device that provides 16 bits of General Purpose parallelInput/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed toenhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvementsinclude higher drive capability, 5 V I/O tolerance, lower supply current, individual I/Oconfiguration, and smaller packaging. I/O expanders provide a simple solution whenadditional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc.The PCA9555 consists of two 8-bit Configuration (Input or Output selection); Input, Outputand Polarity Inversion (active HIGH or active LOW operation) registers. The systemmaster can enable the I/Os as either inputs or outputs by writing to the I/O configurationbits. The data for each Input or Output is kept in the corresponding Input or Outputregister. The polarity of the read register can be inverted with the Polarity Inversionregister. All registers can be read by the system master. Although pin-to-pin and I2C-busaddress compatible with the PCF8575, software changes are required due to theenhancements, and are discussed in Application Note AN469.
上传时间： 2013-11-13
上传用户：fredguo
Introduction to Xilinx packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
