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packaging

  • 《器件封装用户向导》赛灵思产品封装资料

    Introduction to Xilinx packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    标签: 封装 器件 用户 赛灵思

    上传时间: 2013-11-20

    上传用户:不懂夜的黑

  • Welcome to MS4W, the no fuss installer for setting up MapServer on Microsoft Windows platforms. The

    Welcome to MS4W, the no fuss installer for setting up MapServer on Microsoft Windows platforms. The purpose of this package is to allow all levels of MapServer users to quickly install a working environment for MapServer development on Windows. It is also an environment for packaging and distributing MapServer applications.

    标签: MapServer Microsoft installer platforms

    上传时间: 2015-05-30

    上传用户:黄华强

  • Core Java 2 Volume I - Fundamentals, Seventh Edition Completely revised and up-to-date coverage o

    Core Java 2 Volume I - Fundamentals, Seventh Edition Completely revised and up-to-date coverage of Generic programming, restrictions and limitations, type bounds, wilcard types, and generic reflection Swing GUI development, including input validation and other enhancements Exception handling and debugging, including chained exceptions, stack frames, assertions, and logging Streams and files, the new I/O API, memory-mapped files, file locking, and character set encoders/decoders Regular expressions using the powerful java.util.regex package Inner classes, reflection, and dynamic proxies Application packaging and the Preferences API

    标签: Fundamentals Completely up-to-date coverage

    上传时间: 2016-01-01

    上传用户:标点符号

  • The purpose of this chapter is to bring relative newcomers up to speed in writing, compiling, and pa

    The purpose of this chapter is to bring relative newcomers up to speed in writing, compiling, and packaging servlets and JSPs. If you have never developed a servlet or JSP before, or just need to brush up on the technology to jumpstart your development, then the upcoming recipes provide simple programming examples and an overview of the components that you require on the user classpath to compile servlets.

    标签: compiling newcomers relative purpose

    上传时间: 2014-01-13

    上传用户:541657925

  • DESCRIPTION The DCP0105 family is a series of high efficiency, 5V input isolated DC/DC converters.

    DESCRIPTION The DCP0105 family is a series of high efficiency, 5V input isolated DC/DC converters. In addition to 1W nominal galvanically isolated output power capability, the range of DC/DCs are also fully synchronizable. The devices feature thermal shutdown, and overload protection is implemented via watchdog circuitry. Advanced power-on reset techniques give superior reset performance and the devices will start into any capacitive load up to full power output. The DCP0105 family is implemented in standard- molded IC packaging, giving outlines suitable for high volume assembly.

    标签: DESCRIPTION efficiency converters isolated

    上传时间: 2013-11-27

    上传用户:CHENKAI

  • Introduction to Kernel Extension Concepts 1:Hello Kernel: Creating a Kernel Extension With Xcode 2

    Introduction to Kernel Extension Concepts 1:Hello Kernel: Creating a Kernel Extension With Xcode 2:Hello I/O Kit: Creating a Device Driver With Xcode 3:Hello Debugger: Debugging a Device Driver With GDB 4:packaging Your KEXT for Distribution and Installation 5:Loading Kernel Extensions at Boot Time 6:Kernel Extension Dependencies 7:Kernel Extension Ownership and Permissions

    标签: Kernel Extension Introduction Concepts

    上传时间: 2013-12-31

    上传用户:tuilp1a

  • This file may be distributed and/or modified under the terms of the ** GNU General Public License v

    This file may be distributed and/or modified under the terms of the ** GNU General Public License version 2 as published by the Free Software ** Foundation and appearing in the file LICENSE.GPL included in the ** packaging of this file.

    标签: distributed the modified General

    上传时间: 2014-02-17

    上传用户:stella2015

  • Introduction ? ? The ARM Cortex -A8 microprocessor is the first applications microprocessor in A

    Introduction ? ? The ARM Cortex -A8 microprocessor is the first applications microprocessor in ARM!ˉs new Cortex family. With high performance and power efficiency, it targets a wide variety of mobile and consumer applications including mobile phones, set-top boxes, gaming consoles and automotive navigation/entertainment systems. The Cortex-A8 processor spans a range of performance points depending on the implementation, delivering over to 2000 Dhrystone MIPS (DMIPS) of performance for demanding consumer applications and consuming less than 300mW for low-power mobile devices. This translates into a large increase in processing capability while staying with the power levels of previous generations of mobile devices. Consumer applications will benefit from the reduced heat dissipation and resulting lower packaging and integration costs.

    标签: microprocessor Introduction applications Cortex

    上传时间: 2013-12-09

    上传用户:xzt

  • 详细说明:用C#编写的的中国联通Sgip协议

    详细说明:用C#编写的的中国联通Sgip协议,封装了所有协议包,支持多线程,已经投入使用。-C# prepared by the China Unicom Sgip agreement, packaging, all protocols, support multiple threads, are already in use.

    标签: Sgip 编写 中国联通 协议

    上传时间: 2014-01-07

    上传用户:GHF

  • WBG+Materials+for+Power+Electronics

    stract With  global  drivers  such  as  better  energy consumption, energy efficiency and reduction of greenhouse gases, CO 2 emission reduction has become key in every layer of the value chain. Power Electronics has definitely a role to play in these thrilling challenges. From converters down to compound semiconductors, innovation is leading to breakthrough technologies. Wide BandGap, Power Module packaging, growth of Electric Vehicle market will game change the overall power electronic industry and supply chain. In this presentation we  will  review  power  electronics  trends,  from technologies to markets.

    标签: Electronics Materials Power WBG for

    上传时间: 2020-06-07

    上传用户:shancjb