本系统基于STM32单片机设计的非接触式电流检测控制系统,通过OPA548片将所给任意信号放大,由100Ω电阻和INA128芯片进行电流电压转换放大后,利用STM32单片机对获取的电压信号以0.488μs频率采样,利用STM32单片机的FFT库,获得信号的谐波信息。测量电流信号精准,该设计可广泛应用在以STM32单片机为核心控制器件的新型仪表中,性能精准且抗干扰能力强。This system is a non-contact current detection and control system based on STM32 single chip microcomputer. It amplifiesany signal through OPA548 chip, converts and amplifies the current and voltage by 100 Ω resistance and INA128 chip. The obtainedvoltage signal is sampled at the frequency of 0.488 μs by STM 32 single chip microcomputer, and the harmonic information of the signalis obtained by the FFT library of STM 32 single chip microcomputer. The measurement of current signal is accurate. This design can bewidely used in a new instrument with STM 32 single chip microcomputer as its core control device, with accurate performance and stronganti-interference capability.
上传时间： 2022-03-27
上传用户：
特点： 精确度0.1%满刻度 可作各式數學演算式功能如:A+B/A-B/AxB/A/B/A&B(Hi or Lo)/|A|/ 16 BIT类比输出功能 输入与输出绝缘耐压2仟伏特/1分钟(input/output/power) 宽范围交直流兩用電源設計 尺寸小,穩定性高
上传时间： 2014-12-23
上传用户：ydd3625
Automobile electronic systems place high demands ontoday’s DC/DC converters. They must be able to preciselyregulate an output voltage in the face of wide temperatureand input voltage ranges—including load dump transientsin excess of 60V and cold crank voltage drops to 4V. Theconverter must also be able to minimize battery drain inalways-on systems by maintaining high effi ciency over abroad load current range. Similar demands are made bymany 48V nonisolated telecom applications, 40V FireWireperipherals and battery-powered applications with autoplug adaptors. The LT3437’s best in classperformancemeets all of these requirements in a small thermallyenhanced 3mm × 3mm DFN package.
上传时间： 2013-10-15
上传用户：stampede
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
上传时间： 2013-10-10
上传用户：1184599859
/*--------- 8051内核特殊功能寄存器 -------------*/ sfr ACC = 0xE0; //累加器 sfr B = 0xF0; //B 寄存器 sfr PSW = 0xD0; //程序状态字寄存器 sbit CY = PSW^7; //进位标志位 sbit AC = PSW^6; //辅助进位标志位 sbit F0 = PSW^5; //用户标志位0 sbit RS1 = PSW^4; //工作寄存器组选择控制位 sbit RS0 = PSW^3; //工作寄存器组选择控制位 sbit OV = PSW^2; //溢出标志位 sbit F1 = PSW^1; //用户标志位1 sbit P = PSW^0; //奇偶标志位 sfr SP = 0x81; //堆栈指针寄存器 sfr DPL = 0x82; //数据指针0低字节 sfr DPH = 0x83; //数据指针0高字节 /*------------ 系统管理特殊功能寄存器 -------------*/ sfr PCON = 0x87; //电源控制寄存器 sfr AUXR = 0x8E; //辅助寄存器 sfr AUXR1 = 0xA2; //辅助寄存器1 sfr WAKE_CLKO = 0x8F; //时钟输出和唤醒控制寄存器 sfr CLK_DIV = 0x97; //时钟分频控制寄存器 sfr BUS_SPEED = 0xA1; //总线速度控制寄存器 /*----------- 中断控制特殊功能寄存器 --------------*/ sfr IE = 0xA8; //中断允许寄存器 sbit EA = IE^7; //总中断允许位 sbit ELVD = IE^6; //低电压检测中断控制位 8051
上传时间： 2013-10-30
上传用户：yxgi5
#include<iom16v.h> #include<macros.h> #define uint unsigned int #define uchar unsigned char uint a,b,c,d=0; void delay(c) { for for(a=0;a<c;a++) for(b=0;b<12;b++); }; uchar tab[]={ 0xc0,0xf9,0xa4,0xb0,0x99,0x92,0x82,0xf8,0x80,0x90,
上传时间： 2013-10-21
上传用户：13788529953
MMC/SD卡以其优越的性能，在单片机嵌入式设备中得到广泛应用。将MMC/SD卡作为外部掉电存储介质应用于音频信号发生器中，通过8051F330单片机上的SPI接口，实现单片机—MMC/SD卡的存储扩展，设计了此硬件平台上的MMC/SD卡的单片机驱动程序，并给出了相应的程序代码，满足音频信号发生器的大容量存储要求。 Abstract: MMC/SD card is more and more widely used in the single chip embedded devices for their excellent performances.This article introduces the application of MMC/SD card as the external power down storage medium in audio signal generator. The extension technology especially for storage of single chip-MMC/SD card via SPI interfaces in 8051F330 single chip, including designs single chip drive program of MMC/SD card based on hardware platform,and also gives the key coding of the program. The implementation of big capacity storage is meaningful in audio signal generator.
上传时间： 2014-12-27
上传用户：黄华强
摘要: 串行传输技术具有更高的传输速率和更低的设计成本, 已成为业界首选, 被广泛应用于高速通信领域。提出了一种新的高速串行传输接口的设计方案, 改进了Aurora 协议数据帧格式定义的弊端, 并采用高速串行收发器Rocket I/O, 实现数据率为2.5 Gbps的高速串行传输。关键词: 高速串行传输; Rocket I/O; Aurora 协议 为促使FPGA 芯片与串行传输技术更好地结合以满足市场需求, Xilinx 公司适时推出了内嵌高速串行收发器RocketI/O 的Virtex II Pro 系列FPGA 和可升级的小型链路层协议———Aurora 协议。Rocket I/O支持从622 Mbps 至3.125 Gbps的全双工传输速率, 还具有8 B/10 B 编解码、时钟生成及恢复等功能, 可以理想地适用于芯片之间或背板的高速串行数据传输。Aurora 协议是为专有上层协议或行业标准的上层协议提供透明接口的第一款串行互连协议, 可用于高速线性通路之间的点到点串行数据传输, 同时其可扩展的带宽, 为系统设计人员提供了所需要的灵活性[4]。但该协议帧格式的定义存在弊端,会导致系统资源的浪费。本文提出的设计方案可以改进Aurora 协议的固有缺陷,提高系统性能, 实现数据率为2.5 Gbps 的高速串行传输, 具有良好的可行性和广阔的应用前景。
上传时间： 2013-11-06
上传用户：smallfish
Abstract: This application note illustrates the flexibility of the MAX7060 ASK/FSK transmitter. While the currently available evaluationkit (EV kit) has been optimized for the device's use in a specific frequency band (i.e., 288MHz to 390MHz), this document addresseshow the EV kit circuitry can be modified for improved operation at 433.92MHz, a frequency commonly used in Europe. Twoalternative match and filter configurations are presented: one for optimizing drain efficiency, the other for achieving higher transmitpower. Features and capabilities of earlier Maxim industrial, scientific, and medical radio-frequency (ISM-RF) transmitters areprovided, allowing comparison of the MAX7060 to its predecessors. Several design guidelines and cautions for using the MAX7060are discussed.
上传时间： 2013-11-14
上传用户：swaylong
摘要: 串行传输技术具有更高的传输速率和更低的设计成本, 已成为业界首选, 被广泛应用于高速通信领域。提出了一种新的高速串行传输接口的设计方案, 改进了Aurora 协议数据帧格式定义的弊端, 并采用高速串行收发器Rocket I/O, 实现数据率为2.5 Gbps的高速串行传输。关键词: 高速串行传输; Rocket I/O; Aurora 协议 为促使FPGA 芯片与串行传输技术更好地结合以满足市场需求, Xilinx 公司适时推出了内嵌高速串行收发器RocketI/O 的Virtex II Pro 系列FPGA 和可升级的小型链路层协议———Aurora 协议。Rocket I/O支持从622 Mbps 至3.125 Gbps的全双工传输速率, 还具有8 B/10 B 编解码、时钟生成及恢复等功能, 可以理想地适用于芯片之间或背板的高速串行数据传输。Aurora 协议是为专有上层协议或行业标准的上层协议提供透明接口的第一款串行互连协议, 可用于高速线性通路之间的点到点串行数据传输, 同时其可扩展的带宽, 为系统设计人员提供了所需要的灵活性[4]。但该协议帧格式的定义存在弊端,会导致系统资源的浪费。本文提出的设计方案可以改进Aurora 协议的固有缺陷,提高系统性能, 实现数据率为2.5 Gbps 的高速串行传输, 具有良好的可行性和广阔的应用前景。
上传时间： 2013-10-13
上传用户：lml1234lml
