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Backend

  • Complete Hotel Management System Backend Oracle

    Complete Hotel Management System Backend Oracle

    标签: Management Complete Backend System

    上传时间: 2017-07-01

    上传用户:ryb

  • Hibernate: A Developer s Notebook shows you how to use Hibernate to automate persistence: you write

    Hibernate: A Developer s Notebook shows you how to use Hibernate to automate persistence: you write natural Java objects and some simple configuration files, and Hibernate automates all the interaction between your objects and the database. You don t even need to know the database is there, and you can change from one database to another simply by changing a few statements in a configuration file. If you ve needed to add a database Backend to your application, don t put it off. It s much more fun than it used to be, and Hibernate: A Developer s Notebook shows you why.

    标签: Hibernate persistence Developer you

    上传时间: 2016-04-07

    上传用户:123啊

  • Hibernate: A Developer s Notebook shows you how to use Hibernate to automate persistence: you write

    Hibernate: A Developer s Notebook shows you how to use Hibernate to automate persistence: you write natural Java objects and some simple configuration files, and Hibernate automates all the interaction between your objects and the database. You don t even need to know the database is there, and you can change from one database to another simply by changing a few statements in a configuration file. If you ve needed to add a database Backend to your application, don t put it off. It s much more fun than it used to be, and Hibernate: A Developer s Notebook shows you why.

    标签: Hibernate persistence Developer you

    上传时间: 2017-08-16

    上传用户:曹云鹏

  • LoRaWAN Backend Interfaces 1.0 Specification 规范

    LoraWAN后台架构,网络协议和设计规范

    标签: LoRaWAN

    上传时间: 2021-11-27

    上传用户:kingwide

  • 超薄芯片Backend工艺分析及失效研究

    本文主要超薄芯片的背面金属化中的一些问题,阐述了两种主要的背面金属化工艺的建立,并解决了这两个工艺中关键问题,使得工艺获得好的成品率,提高了产品的可靠性,实现了大规模量产。流程(一)介绍了一种通过技术转移在上海先进半导体制造有限公司(ASMC)开发的一种特殊工艺,工艺采用特殊背面去应力工艺,通过机械应力和背银沾污的控制,将背面金属和硅片的黏附力和金硅接触电阻大大改善。论文同时阐述了一种自创的检验黏附力的方法,通过这种方法的监控,大幅度提高了产品良率,本论文的研究课题来源于企业的大规模生产实践,对于同类的低压低导通电阻VDMOS产品有实用的参考意义。流程(二)讨论了在半导体器件中应用最为广泛的金-硅合金工艺的失效模式及其解决办法。并介绍了我公司独创的刻蚀-淀积-合金以及应力控制同时完成的方案。通过这种技术,使得金硅合金质量得到大步的提升,并同时大大减少了背金工艺中的碎片问题,为企业获得了很好的效益。

    标签: 超薄芯片 Backend工艺

    上传时间: 2022-06-25

    上传用户:1208020161