THERMAL
共 66 篇文章
THERMAL 相关的电子技术资料，包括技术文档、应用笔记、电路设计、代码示例等，共 66 篇文章，持续更新中。
英飞凌热阻计算
Thermal－Resistance－calculation英飞凌热阻计算
VICOR2代模块散热考虑问题thermal.pdf
资料->【B】电子技术->【B4】电子专题->【0】电源技术->vicor公司电源设计资料->VICOR2代模块散热考虑问题thermal.pdf
pb106_2gen-thermal.pdf
资料->【B】电子技术->【B4】电子专题->【0】电源技术->vicor公司电源设计资料->pb106_2gen-thermal.pdf
利用可见光和热红外图像对人脸识别性能的比较分析
·We present a comprehensive performance analysis of multiple appearance-based face recognition methodologies on visible and thermal infrared imagery. We compare algorithms within and between modalitie
VI BRICK THERMAL MANAGEMENT.pdf
资料->【B】电子技术->【B4】电子专题->【0】电源技术->vicor公司电源设计资料->VI BRICK THERMAL MANAGEMENT.pdf
The consideration about “heat” in PCB design
<P>The consideration about “heat” in PCB design</P>
<P>The consideration of EMC, thermal conduct an
对MPC750系列微处理器的进行编程的范例程序
This application note describes example software to program the thermal assist unit (TAU)<BR>feature
Introduction of Thermal
Thermal energy transport: <BR>cause by temperature difference, high T -> low T <BR>Conduction<BR>
1N5399
FEATURES
♦ Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
♦ High surge current capability
♦ 1.5 Ampere operation at TL=70°C
with no thermal runaway
♦ Low reverse
热工测量及仪表课程实验教学大纲
<P>热工测量及仪表》课程实验教学大纲</P>
<P>课 程 名 称：热工测量及仪表<BR>英 文 名 称：Thermal m
Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBYTE)
Thermal characteristics of integrated circuit<BR>packages have been and increasingly will be<BR>a ma
Cyclone Series Device Thermal Resistance
<P>Thermal resistance values for Cyclone III devices are provided for a board<BR>meeting JEDEC s
Ansys
ANSYS, Inc. has acquired a number of companies since 2000, including ICEM CFD Engineering, CADOE, CFX, Century Dynamics, Harvard Thermal, Fluent Inc. (2006) and Ansoft Corporation (2008).
HFAN-08.1: Thermal Considerations of QFN and Other Exposed-Paddle Packages
Abstract: This application note will give a brief introduction to thermal theory and general layout
以CS8156 CS8120为例，介绍线性稳压器的热管理
The thermal characteristics of linear regulators depend on<BR>their operating environment and the sy
firstedition
朱伯芳有限单元法原理与应用（第一版），对初学有限元者有很大的帮助。-The thermal stress theory and application of finite element method
Cyclone系列器件的热阻
Tables 1 through 6 in this data sheet provide θJA (junction-to-ambient<BR>thermal resistance) and θJ
Thermal transient characterization methodology for single-die and stacked structures
Thermal transient characterization methodology for single-die and stacked structures:High-power semi
Simplified Approach for Predicting Dynamic Thermal Behavior of Switching Electronic Devices
Simplified Approach for Predicting Dynamic Thermal Behavior of Switching Electronic Devices:Abstract
Thermal Considerations
Thermal Considerations:Thermal management is an important part of the system design process. The sup