Packages
共 80 篇文章
Packages 相关的电子技术资料，包括技术文档、应用笔记、电路设计、代码示例等，共 80 篇文章，持续更新中。
Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBYTE)
Thermal characteristics of integrated circuit<BR>packages have been and increasingly will be<BR>a ma
采用S-FET技术的100V MOS晶体管的介绍及应用说明
<P>Thanks to versions in the SO-8, SOT-<BR>223, DPAK and TO-220 packages,<BR>this technology has now
93C46英文版
The Microchip Technology Inc. 93C46B is a 1K-bit,
low-voltage serial Electrically Erasable PROM. The
device memory is configured as 64 x 16 bits. Advanced
CMOS technology makes this device ideal fo
HFAN-08.1: Thermal Considerations of QFN and Other Exposed-Paddle Packages
Abstract: This application note will give a brief introduction to thermal theory and general layout
RF
有关射频知识相关的培训资料压缩包，感兴趣的可以学习学习。-RF knowledge and relevant training data compression packages
ATLS1A102 Low Noise Constant Current Laser Driver
The controller has 2 types of mounting packages: through hole and surface mount. The latter saves PC
KLX-LBBAN 1W Blue LED SPECIFICATION
Kingluxeon Emitter is one of the highest flux performance High Power LED<BR>packages in the world. I
KLX-LGBAN 1W Green LED SPECIFICATION
Kingluxeon Emitter is one of the highest flux performance High Power LED<BR>packages in the world. I
SPECCTRAQuest电源完整性设计指导.rar
电源完整性(PI)设计指导
第1 章 简介......................................................1
1.1 面临的挑战：高速PCB 设计中的电源完整性问题（PI）..................................................1
1.2 解决方法:SPECCTRAQuest Power Integr
EFM8BB21F16G-C-QFN20R 芯片手册
<p>With on-chip power-on reset, voltage supply monitor, watchdog timer, and clock oscillator, the EFM8BB2 devices are truly standalone<br/>system-on-a-chip solutions. The flash memory is reprogrammabl
基于STC89C52单片机的智能家用料理机的设计与实现
<p>基于STC89C52单片机,将厨房各种调料封装,运用电源电路技术及超声波测距传感器检测水位,设计了一款智能家用料理机。详细阐述了设计原理,重点分析了液体传输模块和水位检测报警模块的设计方法,最后给出了具体外观设计方案。该款智能家用料理机实现了液体调料的获取与添置,并可实时监测,缺水报警,方便、环保、智能,有效节省厨房空间。</p><p>Based on STC89C52 single-chi
l298电机芯片驱动原理 (DUAL FULL-BRIDGE DRIVER)
The L298 is an integratedmonolithic circuit in a 15- lead Multiwatt and PowerSO20 packages. It is a
STM32F10x_FW_Archive
旧版本的STM32F10xxx固件库V2.0.3和所有相关固件包归档<br>
(Archive for legacy STM32F10xxx Firmware Library V2.0.3 and all related
Firmware packages)
详述STM32F401参考资料以及数据手册
This reference manual targets application developers。It provides complete information on how to use the STM32F401xB/C and STM32F401xD/E microcontroller memory and peripherals.STM32F401xB/C and STM32F4
12路触摸按键IC TSM12 数据手册
<p>非常难得12路触摸按键数据手册，韩国ADS TSM12MC</p><p><br/></p><p>1 Specification </p><p>1.1 General Feature </p><p> 12-Channel capacitive sensor with auto sensitivity calibration </p><p> Selectable
STM32F103RCT6寄存器编程手册 1132页完整版
<p>该文件当为STM32F103RCT6寄存器说明手册，英文版，从ST官网下载，方便大家使用。</p><p>This reference manual is addressed to application developers.</p><p> It provides complete information on how to use the STM32F101xx, STM32F1
台湾华邦W25Q128FVSIG闪存芯片datasheet（英文版）
<p>品牌：Winbond</p><p>型号：W25Q128FVSIG</p><p>功能：flash存储器</p><p>内存：128M-bit<br/></p><p><br/></p><p>The W25Q128FV (128M-bit) Serial Flash memory provides a storage solution for systems with limited</p><p>s
LQFP,TQFP,QFP,CQFP封装尺寸表
<p>Low Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footpr
ROS操作系统的入门资料
<p>ROS的首要设计目标是在机器人研发领域提高代码复用率。ROS是一种分布式处理框架(又名Nodes)。这使可执行文件能被单独设计，并且在运行时松散耦合。这些过程可以封装到数据包(Packages)和堆栈(Stacks)中，以便于共享和分发。ROS还支持代码库的联合系统。使得协作亦能被分发。这种从文件系统级别到社区一级的设计让独立地决定发展和实施工作成为可能。上述所有功能都能由ROS的基础工具实
pcie处理层协议中文详解
<p>pcie（PCI-Express）处理层协议中文详解</p><p>处理层协议（transaction Layer specification）</p><p>◆TLP概况。</p><p>◆寻址定位和路由导向。</p><p>◆i/o，.memory，configuration，message request、completion 详解。</p><p>◆请求和响应处理机制。</p><p>◆virt