Mounting
共 13 篇文章
Mounting 相关的电子技术资料，包括技术文档、应用笔记、电路设计、代码示例等，共 13 篇文章，持续更新中。
HM62256B Series
The Hitachi HM62256B Series is a CMOS static RAM organized 32,768-word ´ 8-bit. It realizes higher
performance and low power consumption by employing 0.8 mm Hi-CMOS process technology. The
device, p
Body Mount 2.4GHz Antennas
These new antennas compliment Mobile Mark's 2.4GHz<BR>antenna product line with a new mounting optio
iButton ID Badge Mounting Options
Abstract: The iButton® can be easily used as a credential for identification, access control, an
ATLS1A102 Low Noise Constant Current Laser Driver
The controller has 2 types of mounting packages: through hole and surface mount. The latter saves PC
High Density Mounting Type Photocioupler
<P>Lesd forming tvpe and taping reel type are also available，（PC817X1/PC817XP）</P>
IN4007整流二极管
<p>EATURE Low forward voltage High current capabilit Low leakage current High surge capability Low cost MECHANICAL DATA Case: Molded plastic use UL 94V-0 recognized Flame retardant epoxy Terminals: Ax
SLX-8MG-1_datasheet[1]
8 Gigabit ports for 10/100/1000 Ethernet links
4 advanced combination ports accept copper RJ45
or noise-immune fi ber optic links up to 80+ km
Fully managed w/ advanced features and security
SMT操作员培训手册-SMT培训资料(全)
<p style="text-align:center;line-height:150%">第一章 SMT简介</p><p style="line-height:150%"> </p><p style="margin-left:32px;line-height:150%">SMT 是Surface mounting technology的简写，意为表面贴装技术。</p><p
贴片铝电解电容封装库
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贴片铝电解电容封装库
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<span class="fontstyle0">SMD Aluminum Electrolytic Capacitors </span><span class="fontstyle2">VE<br />
</span><span class="fontstyle3">Features<br />
</span><span class="font
MEMS惯性传感器的焊接指南
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Abstract: Standard PCB design and mounting processes can adversely influence MEMS inertial sensors.This application note contains guidelines for the layout, soldering, and mounting of MEMS iner
多层印制板设计基本要领
【摘要】本文结合作者多年的印制板设计经验，着重印制板的电气性能，从印制板稳定性、可靠性方面，来讨论多层印制板设计的基本要求。<BR>【关键词】印制电路板；表面贴装器件；高密度互连；通孔<BR>【Key words】Printed Circuit Board；Surface Mounting Device；High Density Interface；Via<BR>一．概述<BR>印制板（PCB－P
基于OMAP1510的mp3播放器设计
<P> 第一章 序論……………………………………………………………6</P>
<P> 1- 1 研究動機…………………………………………………………..7</P>
<P> 1- 2 專題目標…………………………………………………………..8</P>
<P> 1- 3 工作流程…………………………………………………………..9</P>
<P> 1- 4 開發環境與設備……………………………
多层印制板设计基本要领
【摘要】本文结合作者多年的印制板设计经验，着重印制板的电气性能，从印制板稳定性、可靠性方面，来讨论多层印制板设计的基本要求。<BR>【关键词】印制电路板；表面贴装器件；高密度互连；通孔<BR>【Key words】Printed Circuit Board；Surface Mounting Device；High Density Interface；Via<BR>一．概述<BR>印制板（PCB－P