PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution....
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution....
使用Nios II紧耦合存储器教程 Chapter 1...
One of the most misunderstood constructs in the Verilog language is the nonblockingassign...
In this paper, we discuss efficient coding and design styles using verilog. This can beim...
Silicon Motion, Inc. has made best efforts to ensure that the information contained in this document...
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of...
LAYOUT REPORT .............. 1 目錄.................. 1 1. PCB LAY...
This document provides practical, common guidelines for incorporating PCI Express interconnect layou...
OSERL (Open SMPP Erlang Library) is an erlang implementation of the Short Message Peer to Peer proto...
制作本书的目的是为了方便大家的阅读。转载时请保持本电子书的完整性。 前言、条款2、16、21、44根据从Addison-Wesley出版社下载的开放条款翻译。条款26、27、28、45根据从Sc...