This document provides an overview of the MPC8313E PowerQUICC™II Pro processor features, including a block diagram showing the major functional components.
标签： PowerQUICC 8313E 8313 MPC
上传时间： 2013-11-19
上传用户：myworkpost
This is the Xilinx Dual Processor Reference Designs suite. The designs illustrate a few differentdual-core architectures based on the MicroBlaze™ and PowerPC™ processors. The designsillustrate various concepts described in the Xilinx White Paper WP262 titled, “DesigningMultiprocessor Systems in Platform Studio”. There are simple software applications includedwith the reference designs that show various forms of interaction between the two processors.
上传时间： 2013-10-29
上传用户：旭521
The use of the Wind River VxWorks Real-Time Operating System (RTOS) on Virtex™-4embedded PowerPC™ processors continues to be a popular choice for high performanceFPGA designs. The introduction of the Wind River Workbench design environment has enableda new and easier way for designers to control the configuration of the VxWorks kernel. Thisguide shows the steps required to build and configure a ML403 Embedded DevelopmentPlatform to boot and run the VxWorks RTOS. A VxWorks bootloader is created, programmedinto Flash, and used to boot the design. The concepts presented here can be scaled to anyPowerPC enabled development platform.
上传时间： 2013-10-26
上传用户：agent
RealView™ 编译工具 2.0 版 Windows 版安装指南 本绪言介绍 RealView™ 编译工具 2.0 版入门指南 和其它用户文档。其中包含下列 各部分： • 第 vi 页的关于本书； • 第 ix 页的反馈。 本书按下列各章组织： 第 1 章简介 阅读此章，了解 RealView 编译工具 的简介(RVCT)。 第 2 章嵌入式软件开发 阅读此章，了解如何用 RVCT 开发嵌入式应用程序的详细信息。 它 描述与目标系统无关的默认 RVCT 行为，以及如何调整 C 库和映像 内存映射以适应您的目标系统。 第 3 章使用过程调用标准 阅读此章，了解如何使用 ARM-Thumb 过程调用标准。 使用此标准 可以更方便地确保分别编译和汇编的模块可以协同工作。 第 4 章ARM 和 Thumb 交互操作 阅读此章，了解编写实现 Thumb ® 指令集的处理器代码时，如何在 ARM 状态和 Thumb 状态之间切换的详细信息。 第 5 章混合使用 C、C++ 和汇编语言 阅读此章，了解如何编写 C、C++ 和 ARM 汇编语言混合代码的详 细信息。 它还描述如何从 C 和 C++ 使用 ARM 内联和嵌入式汇编程 序。
标签： Compilation RealView 用户手册
上传时间： 2013-10-23
上传用户：fudong911
解压密码：www.elecfans.com 随着微电子技术的迅速发展以及集成电路规模不断提高，对电路性能的设计 要求越来越严格，这势必对用于大规模集成电路设计的EDA 工具提出越来越高的 要求。自1972 年美国加利福尼亚大学柏克莱分校电机工程和计算机科学系开发 的用于集成电路性能分析的电路模拟程序SPICE（Simulation Program with IC Emphasis）诞生以来，为适应现代微电子工业的发展，各种用于集成电路设计的 电路模拟分析工具不断涌现。HSPICE 是Meta-Software 公司为集成电路设计中 的稳态分析，瞬态分析和频域分析等电路性能的模拟分析而开发的一个商业化通 用电路模拟程序，它在柏克莱的SPICE（1972 年推出），MicroSim公司的PSPICE （1984 年推出）以及其它电路分析软件的基础上，又加入了一些新的功能，经 过不断的改进，目前已被许多公司、大学和研究开发机构广泛应用。HSPICE 可 与许多主要的EDA 设计工具，诸如Candence,Workview 等兼容，能提供许多重要 的针对集成电路性能的电路仿真和设计结果。采用HSPICE 软件可以在直流到高 于100MHz 的微波频率范围内对电路作精确的仿真、分析和优化。在实际应用中， HSPICE能提供关键性的电路模拟和设计方案，并且应用HSPICE进行电路模拟时， 其电路规模仅取决于用户计算机的实际存储器容量。 The HSPICE Integrator Program enables qualified EDA vendors to integrate their products with the de facto standard HSPICE simulator, HSPICE RF simulator, and WaveView Analyzer™. In addition, qualified HSPICE Integrator Program members have access to HSPICE integrator application programming interfaces (APIs). Collaboration between HSPICE Integrator Program members will enable customers to achieve more thorough design verification in a shorter period of time from the improvements offered by inter-company EDA design solutions.
上传时间： 2013-11-10
上传用户：123312
Xilinx UltraScale™ 架构针对要求最严苛的应用，提供了前所未有的ASIC级的系统级集成和容量。 UltraScale架构是业界首次在All Programmable架构中应用最先进的ASIC架构优化。该架构能从20nm平面FET结构扩展至16nm鳍式FET晶体管技术甚至更高的技术，同 时还能从单芯片扩展到3D IC。借助Xilinx Vivado®设计套件的分析型协同优化，UltraScale架构可以提供海量数据的路由功能，同时还能智能地解决先进工艺节点上的头号系统性能瓶颈。 这种协同设计可以在不降低性能的前提下达到实现超过90%的利用率。 UltraScale架构的突破包括： • 几乎可以在晶片的任何位置战略性地布置类似于ASIC的系统时钟，从而将时钟歪斜降低达50% • 系统架构中有大量并行总线，无需再使用会造成时延的流水线，从而可提高系统速度和容量 • 甚至在要求资源利用率达到90%及以上的系统中，也能消除潜在的时序收敛问题和互连瓶颈 • 可凭借3D IC集成能力构建更大型器件，并在工艺技术方面领先当前行业标准整整一代 • 能在更低的系统功耗预算范围内显著提高系统性能，包括多Gb串行收发器、I/O以及存储器带宽 • 显著增强DSP与包处理性能 赛灵思UltraScale架构为超大容量解决方案设计人员开启了一个全新的领域。
标签： UltraScale Xilinx 架构
上传时间： 2013-12-23
上传用户：小儒尼尼奥
中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
标签： UltraScale Xilinx 架构
上传时间： 2013-11-21
上传用户：wxqman
使用Nios II软件构建工具 This chapter describes the Nios® II Software Build Tools (SBT), a set of utilities and scripts that creates and builds embedded C/C++ application projects, user library projects, and board support packages (BSPs). The Nios II SBT supports a repeatable, scriptable, and archivable process for creating your software product. You can invoke the Nios II SBT through either of the following user interfaces: ■ The Eclipse™ GUI ■ The Nios II Command Shell The purpose of this chapter is to make you familiar with the internal functionality of the Nios II SBT, independent of the user interface employed.
上传时间： 2013-10-11
上传用户：china97wan
面向Eclips的Nios II软件构建工具手册 The Nios® II Software Build Tools (SBT) for Eclipse™ is a set of plugins based on the Eclipse™ framework and the Eclipse C/C++ development toolkit (CDT) plugins. The Nios II SBT for Eclipse provides a consistent development platform that works for all Nios II embedded processor systems. You can accomplish all Nios II software development tasks within Eclipse, including creating, editing, building, running, debugging, and profiling programs.
上传时间： 2013-11-01
上传用户：瓦力瓦力hong
This application note describes how to retrieve user-defined data from Xilinx configurationPROMs (XC18V00 and Platform Flash devices) after the same PROM has configured theFPGA. The method to add user-defined data to the configuration PROM file is also discussed.The reference design described in this application note can be used in any of the followingXilinx FPGA architectures: Spartan™-II, Spartan-IIE, Spartan-3, Virtex™, Virtex-E, Virtex-II,and Virtex-II Pro.
上传时间： 2013-10-08
上传用户：guojin_0704
