Design for Manufacturability and statistical design encompass a number of activities and areas of study spanning the integrated circuit design and manufacturing worlds. In the early days of the planar integrated circuit, it was typical for a handful of practitioners working on a particular design to have a fairly complete understanding of the manufacturing process, the resulting semiconductor active and passive devices, as well as the resulting circuit - often composed of as few as tens of devices. With the success of semiconductor scaling, predicted and - to a certain extent even driven - by Moore’s law, and the vastly increased complexity of modern nano-meter scale processes and the billion-device circuits they allow, there came a necessary separation between the various disciplines.
标签： Manufacturability Statistical Design for and
上传时间： 2020-06-10
上传用户：shancjb
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount Manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
上传时间： 2013-10-10
上传用户：1184599859
The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and Manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. T
标签： mechanical polishing Chemical
上传时间： 2020-06-05
上传用户：shancjb
