Interface 8051 to Coolrunner CPLD(Xilinx App)
标签： Coolrunner Interface Xilinx 8051
上传时间： 2013-09-05
上传用户：bcjtao
power pcb To protel 软件
上传时间： 2013-09-10
上传用户：sunshine1402
Can convert data file(txt format)to CAD(scr)file,and draw curve!
上传时间： 2013-09-11
上传用户：天空说我在
gerber-to-protel is a pdf file ,which is used for convert bmp to pcb.
标签： gerber-to-protel file is
上传时间： 2013-09-18
上传用户：liuxinyu2016
以某高速实时频谱仪为应用背景，论述了5 Gsps采样率的高速数据采集系统的构成和设计要点，着重分析了采集系统的关键部分高速ADC（analog to digital，模数转换器）的设计、系统采样时钟设计、模数混合信号完整性设计、电磁兼容性设计和基于总线和接口标准（PCI Express）的数据传输和处理软件设计。在实现了系统硬件的基础上，采用Xilinx公司ISE软件的在线逻辑分析仪（ChipScope Pro）测试了ADC和采样时钟的性能，实测表明整体指标达到设计要求。给出上位机对采集数据进行处理的结果，表明系统实现了数据的实时采集存储功能。
上传时间： 2014-11-26
上传用户：黄蛋的蛋黄
PCI ExpressTM Architecture Add-in Card Compliance Checklist for the PCI Express Base 1.0a SpecificationThe PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein.Contact the PCI Special Interest Group office to obtain the latest revision of this checklistQuestions regarding the ths document or membership in the PCI Special Interest Group may be forwarded tPCI Special Interest Group5440 SW Westgate Drive #217Portland, OR 97221Phone: 503-291-2569Fax: 503-297-1090 DISCLAIMERThis document is provided "as is" with no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or sample. The PCI SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
标签： Architecture ExpressTM PCI
上传时间： 2013-11-03
上传用户：gy592333
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2013-10-15
上传用户：busterman
R7732_7733_7735是Richpower公司推出的高效AC TO DC 电源PWM控制芯片,最大功率可以做到75W;如有需求请联系我电话：021-54262182EXT 114 (Eric) QQ ：1187337351
上传时间： 2013-11-20
上传用户：xz85592677
长电c2383 TO-92L
上传时间： 2013-11-08
上传用户：wvbxj
PCI ExpressTM is the third generation of PCI (PeripheralComponent Interconnect) technology used to connect I/Operhipheral devices in computer systems. It is intended asa general purpose I/O device interconnect that meets theneeds of a wide variety of computing platforms such asdesktop, mobile, server and communications. It alsospecifies the electrical and mechanical attributes of thebackplane, connectors and removable cards in thesesystems.
上传时间： 2013-11-17
上传用户：squershop
