Interface 8051 to Coolrunner CPLD(Xilinx App)
标签： Coolrunner Interface Xilinx 8051
上传时间： 2013-09-05
上传用户：bcjtao
该工程文件实现ARM系统中CPLD的逻辑工作，起到外围资源的逻辑地址译码功能
上传时间： 2013-09-05
上传用户：zcs023047
cpld的入门交流：CPLD的跑馬燈一个简易型cpld试验电路用VHDL语言遍的
上传时间： 2013-09-06
上传用户：blacklee
用VHDL语言在CPLD上实现串行通信
上传时间： 2013-09-06
上传用户：q3290766
这是可编程逻辑器件（CPLD）初学者的入门级文章，仅供参考。
上传时间： 2013-09-06
上传用户：dudu121
CPLD/FPGA是目前诮用最为广泛的两种可编程专用集成电路（ASIC），特别适合于产品的样品开发与小批量生产。本书从现代电子系统设计的角度出发，以全球著名的可编程逻辑器件供应商Xilinx公司的产品为背景，系统全面地介绍该公司的CPLD/FPGA产品的结构原理、性能特点、设计方法以及相应的EDA工具软件，重点介绍CPLD/FPGA在数字系统设计、数字通信与数字信号处理等领域中的应用。\r\n 本书内容新颖、技术先进、由浅入深，既有关于大规模可编辑逻辑器件的系统论述，又有丰富的设计应用实例。对于从事各类
上传时间： 2013-09-06
上传用户：Maple
用cpld实现曼彻斯特编码\r\n用verilog HDL进行曼彻斯特编码，用于通信中
上传时间： 2013-09-07
上传用户：786334970
PCI ExpressTM Architecture Add-in Card Compliance Checklist for the PCI Express Base 1.0a SpecificationThe PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein.Contact the PCI Special Interest Group office to obtain the latest revision of this checklistQuestions regarding the ths document or membership in the PCI Special Interest Group may be forwarded tPCI Special Interest Group5440 SW Westgate Drive #217Portland, OR 97221Phone: 503-291-2569Fax: 503-297-1090 DISCLAIMERThis document is provided "as is" with no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or sample. The PCI SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
标签： Architecture ExpressTM PCI
上传时间： 2013-11-03
上传用户：gy592333
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2013-10-15
上传用户：busterman
PCI ExpressTM is the third generation of PCI (PeripheralComponent Interconnect) technology used to connect I/Operhipheral devices in computer systems. It is intended asa general purpose I/O device interconnect that meets theneeds of a wide variety of computing platforms such asdesktop, mobile, server and communications. It alsospecifies the electrical and mechanical attributes of thebackplane, connectors and removable cards in thesesystems.
上传时间： 2013-11-17
上传用户：squershop
