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General-Purpose

  • 红外动目标识别跟踪系统DSPFPGA硬件设计与实现

    视频目标识别与跟踪技术是当今世界重要的研究课题,它涉及图像处理、自动控制、计算机应用等学科,该文主要论述该项目的具体实现及相关理论分析,重点在于该系统的硬件模块实现及分析.该系统的硬件模块是典型的高速数字电路,这也是当今世界电路设计的一大热点.同时,该系统的硬件模块不同于传统的模拟、数字电路.严格的说它是基于可编程芯片的系统(System On Programmable Chip).它与传统电路的最大不同在于,硬件模块本身不具备任何功能,但该硬件模块可以与相应的软件结合(此处,我们将FPGA中的可编程指令也广义的归入软件范畴),实现相应的功能.换言之,该硬件模块通过换用其他软件,可以实现其他功能.所以从这个意义上讲,我们也可以将其称为基于可编程芯片的通用平台系统(General System On Programmable Chip).此外,该文还对该系统进行了尝试性的层状结构描述,这种描述同样适用于其它IT目的或电子系统.

    标签: DSPFPGA 红外 目标识别 硬件设计

    上传时间: 2013-04-24

    上传用户:yumiaoxia

  • 如何用ST7 PWM ST7 BRM产生模拟信号输出(50Hz正弦波)

    The purpose of this note is to present how to use the ST7 PWM/BRM for the generation of a50Hz si

    标签: ST7 PWM BRM 50

    上传时间: 2013-06-01

    上传用户:huyanju

  • LM621无刷电机换向器

    General Description The LM621 is a bipolar IC designed for commutation of brushless DC motors. The part is compatible with both three- and four-phase motors. It can directly drive the power switching devices used to drive the motor. The LM621 provides an adjustable dead-time circuit to eliminate ``shootthrough'' current spiking in the power switching circuitry. Operation is from a 5V supply, but output swings of up to 40V are accommodated. The part is packaged in an 18-pin, dual-in-line package.

    标签: 621 LM 无刷电机

    上传时间: 2013-07-24

    上传用户:sdq_123

  • 高精度I2C实时时钟的设计

    Abstract: This application note presents an overview of the operational characteristics of accurate I²C real-time clocks (RTCs),including the DS3231, DS3231M, and DS3232. It focuses on general application guidelines that facilitate use of device resources forpower management, I²C communication circuit configurations, and I²C characteristics relative to device power-up sequences andinitializations. Additional discussions on decoupling are provided to support developing strategies for mitigating power-supply pushingof device frequency.

    标签: I2C 高精度 实时时钟

    上传时间: 2013-11-23

    上传用户:WMC_geophy

  • 利用数字电位器调整并校准升压型DC-DC转换器

    The purpose of this application note is to show an example of how a digital potentiometer can be used in thefeedback loop of a step-up DC-DC converter to provide calibration and/or adjustment of the output voltage.The example circuit uses a MAX5025 step-up DC-DC converter (capable of generating up to 36V,120mWmax) in conjunction with a DS1845, 256 position, NV digital potentiometer. For this example, the desiredoutput voltage is 32V, which is generated from an input supply of 5V. The output voltage can be adjusted in35mV increments (near 32V) and span a range wide enough to account for resistance, potentiometer and DCDCconverter tolerances (27.6V to 36.7V).

    标签: DC-DC 数字电位器 升压型 校准

    上传时间: 2014-12-23

    上传用户:781354052

  • 意法半导体运放稳定性

      Who has never experienced oscillations issues when using an operational amplifier? Opampsare often used in a simple voltage follower configuration. However, this is not the bestconfiguration in terms of capacitive loading and potential risk of oscillations.Capacitive loads have a big impact on the stability of operational amplifier-basedapplications. Several compensation methods exist to stabilize a standard op-amp. Thisapplication note describes the most common ones, which can be used in most cases.The general theory of each compensation method is explained, and based on this, specific

    标签: 半导体 运放 稳定性

    上传时间: 2013-10-28

    上传用户:chenbhdt

  • DA转换接口的射频IQ调制

      Linear Technology’s High Frequency Product lineupincludes a variety of RF I/Q modulators. The purpose ofthis application note is to illustrate the circuits requiredto interface these modulators with several popular D/Aconverters. Such circuits typically are required to maximizethe voltage transfer from the DAC to the baseband inputsof the modulator, as well as provide some reconstructionfi ltering.

    标签: DA转换 接口 射频 调制

    上传时间: 2013-10-19

    上传用户:FreeSky

  • PCI ExpressTM Architecture

    PCI ExpressTM Architecture Add-in Card Compliance Checklist for the PCI Express Base 1.0a SpecificationThe PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein.Contact the PCI Special Interest Group office to obtain the latest revision of this checklistQuestions regarding the ths document or membership in the PCI Special Interest Group may be forwarded tPCI Special Interest Group5440 SW Westgate Drive #217Portland, OR 97221Phone: 503-291-2569Fax: 503-297-1090 DISCLAIMERThis document is provided "as is" with no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or sample.  The PCI SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this specification.  No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.

    标签: Architecture ExpressTM PCI

    上传时间: 2013-11-03

    上传用户:gy592333

  • PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs

    Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.

    标签: Considerations Guidelines and Design

    上传时间: 2013-10-14

    上传用户:ysystc699

  • pcb layout规则

    LAYOUT REPORT .............. 1   目錄.................. 1     1. PCB LAYOUT 術語解釋(TERMS)......... 2     2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2     3. 基準點 (光學點) -for SMD:........... 4     4. 標記 (LABEL ING)......... 5     5. VIA HOLE PAD................. 5     6. PCB Layer 排列方式...... 5     7.零件佈置注意事項 (PLACEMENT NOTES)............... 5     8. PCB LAYOUT 設計............ 6     9. Transmission Line ( 傳輸線 )..... 8     10.General Guidelines – 跨Plane.. 8     11. General Guidelines – 繞線....... 9     12. General Guidelines – Damping Resistor. 10     13. General Guidelines - RJ45 to Transformer................. 10     14. Clock Routing Guideline........... 12     15. OSC & CRYSTAL Guideline........... 12     16. CPU

    标签: layout pcb

    上传时间: 2013-12-20

    上传用户:康郎